研發績效
期刊: 96 筆
獲獎: 13 筆 |
研討會: 55 筆
技術報告: 4 筆 |
專書: 7 筆
計畫案: 17 筆 |
2024
期刊
Joining of SiO2 glass and substrate using In49Sn active solder in air, J Mater Sci: Mater Electron , 0, 35, 81-81
2023
研討會
Effects of Heat Treatment on Microstructure evolution and Mechanical Properties of As-extruded LAZ1010 Alloys, International Conference on Applied Engineering, Materials and Mechanics (8th ICAEMM 2023), 首爾, 大韓民國(南韓)
期刊
Improved Mechanical and Corrosion Properties of Powder Metallurgy Austenitic, Ferritic, and Martensitic Stainless Steels by Liquid Phase Sintering, Materials, 0, 15, 5483-5483
2022
研討會
添加石墨稀對鋅-空氣燃料電池之放電效率的影響, 111年度防蝕工程年會暨論文發表會, 高雄, 中華民國
獲獎
2022 華立材料大賽, 中國材料科學學會, 中華民國
獲獎
全球前 2% 頂尖科學家榜單(World’s Top 2% Scientists 2020)-2020年科學影響力頂尖科學家, Scopus , 美國
2021
期刊
Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper, Advances in Materials Science and Engineering, 0, 0, 1-7
期刊
Effects of Adding Active Elements to Aluminum-Based Filler Alloys on the Bonding of 6061 Aluminum Alloy and Alumina, Appl. Sci., 0, 11, 1-16
2020
研討會
曹龍泉*, Effects of different electrolyte systems on microstructure, corrosion behavior and antibacterial properties of micro-arc oxidation ceramic coatings of commercially pure titanium, 2020 4th European Conference on Materials, Mechatronics and Manufacturing, Greece, 希臘共和國, 1-6
研討會
曹龍泉*, 含銅抗菌316不銹鋼之特性研究, 109年度防蝕工程年會暨論文發表會, 雲林, 中華民國
期刊
Effects of Different Electrolytes on Microstructure and Antibacterial Properties of Microarc Oxidized Coatings of CP-Ti, International Journal of Materials, Mechanics and Manufacturing, 8, 2, 34-39
期刊
Effect of Heat Treatment Conditions on the Mechanical Properties and Machinability of Ti15SnxCu Alloys, Materials Research, 23, 3, 1-9
2019
研討會
曹龍泉*, Jewelry material–present and future, ISIC 2019 – International Seminar on Investment Casting, Taichung, 中華民國
研討會
曹龍泉*, 超音波輔助活性接合製備7075鋁基-碳纖維金屬基積層板之研究, 科技部工程司108年度機械固力、熱流、能源學門聯合成果發表會 , 台北, 中華民國
專書
曹龍泉*, Fillers – Synthesis, Characterization and Industrial Application, IntechOpen, Active Solders and Active Soldering, ISBN: 10.5772/intechopen.82382
2018
研討會
黃彥樺, 張世穎, 林照凱, 曹龍泉*, Sn-8Zn-3Bi與Sn-8Zn-3Bi-4Ti-0.1Re合金在3.5wt.%NaCl水溶液中之電化學腐蝕行為研究, 107年度防蝕工程年會暨論文發表會(2018), 台東, 中華民國, 1-1
研討會
曹龍泉*, Electrochemical behavior of Ti-Cu-Sn alloys in the 0.2 wt.%NaF mouthwashes, 29th Annual Meeting of the European Society for Biomaterials, 9/9–13, Maastricht, 荷蘭王國, 1-4
研討會
曹龍泉*, A study of direct writing the low-melting-point In-based active alloy ink to directly make a solidified circuit, 科技部工程司機械固力、熱流與能源學門聯合成果發表會, 嘉義, 中華民國, 1-1
研討會
楊州斌, 曹龍泉*, 呂宗炫, 蔡雅竹, 余勇慶, 張世穎, AZ31鎂合金熱噴塗鋁塗層之腐蝕行為, 107年度防蝕工程年會暨論文發表會, 台東, 中華民國, 1-1
研討會
The study of toner on the moisturizing skin by use differences between skin activating apparatus makeup and traditional makeup, 2018 International Conference on Interdisciplinary Design and Industrial-Academic Collaboration,, Kaohsiung, 中華民國, 1-8
獲獎
107年學年度研究生研究成果獎勵獎, 屏東科技大學, 中華民國
期刊
Effects of nanoparticles on the thermal, microstructural and mechanical properties of novel Sn3.5Ag0.5Zn composite solders, Journal of Materials Science: Materials in Electronics, SPRINGER, 29, 4096-4105
期刊
Effects of applied voltage on the microstructure and properties of hydroxyapatite bioceramic coatings formed on Ti7Cu5Sn titanium alloy by micro-arc oxidation, Corrosion Engineering, Science and Technology , TAYLOR & FRANCIS, 53, 528-590
期刊
Effects of Sn additions on microstructure and corrosion resistance of heat-treated Ti–Cu–Sn titanium alloys, Corrosion Engineering, Science and Technology , TAYLOR & FRANCIS, 53, 252-258
期刊
Direct active soldering of Al0.3CrFe1.5MnNi0.5 high entropy alloy to 6061-Al using Sn−Ag−Ti active solder, Trans. Nonferrous Met. Soc. China, Elsevier, 28, 748-756
2017
研討會
曹龍泉*, 新型無鉛Cu5SixSn青銅合金應用於銅鐘之研發, 106年度工程技術發展處「技術及知識應用型產學合作計畫成果發表暨績效考評會議, 台南, 中華民國, 1-1
研討會
Preparation and characterization of biomimetically and electrochemically deposited hydroxyapatite coatings on micro-arc oxidized Ti-7Cu-5Sn, 2016台灣鍍膜科技協會年會(TACT 2016)暨科技部專題計畫研究成果發表會論文集, 屏東, 中華民國
研討會
Effects of different electrolyte systems on microstructure, corrosion behavior and antibacterial properties of micro-arc oxidation ceramic coatings of commercially pure titanium, 2016台灣鍍膜科技協會年會(TACT 2016)暨科技部專題計畫研究成果發表會論文集, 屏東, 中華民國
研討會
Effect of tio2 nanoparticles on the corrosion property of novel Sn3.5Ag0.5Bi solders, 4th world congress and expo on nanotechnology & Materials Science, Barcelona, 西班牙王國
研討會
Effect of Microstructure on the Performance of a LA92 Alloy Anode for Mg-Air Battery Application, International Conference on Advances in Functional Materials, LA, 美國
期刊
Influences of argon plasma cleaning on the die-shear force of chip and copper/polyimide flexible substrate assembly using a non-conductive film, Journal of the Chinese Institute of Engineers, ----, 33
期刊
Influence of Cu addition on the structures and properties of Ti15SnxCu alloys, Materials science and technology, ----, 33
期刊
Effects of Cu addition on the microstructure and mechanical properties of Ti15Sn alloys, Materials Science & Engineering A, ----, 698
2016
研討會
Preparation and characterization of biomimetically and electrochemically deposited hydroxyapatite coatings on micro-arc oxidized Ti-7Cu-5Sn, 2016台灣鍍膜科技協會年會(TACT 2016)暨科技部專題計畫研究成果發表會, 屏東, 中華民國
研討會
Effects of different electrolyte systems on microstructure, corrosion behavior and antibacterial properties of micro-arc oxidation ceramic coatings of commercially pure titanium, 2016台灣鍍膜科技協會年會(TACT 2016)暨科技部專題計畫研究成果發表會, 屏東, 中華民國
研討會
鎂合金作為鎂燃料電池陽極材料的性能研究, 2016第十一屆全國氫能與燃料電池學術研討會暨第三屆台灣能源學會年會, 台北, 中華民國
研討會
以Sn-Ag-Cu-Ti活性銲料直接活性接合6061 Al/MAO-6061Al, 2016年台灣陶瓷學會年會暨科技部專題研究計畫成果發表會, 屏東, 中華民國
期刊
Selective electrode patterning of ITO films using pulsed, Opt Quant Electron, ----, 48
期刊
Active soldering of aluminum–graphite composite to aluminum using Sn3.5Ag4Ti0.5Cu active filler, Int. J. Mater. Res., ----, 107
期刊
“Effect ofnano-TiO2 particles andcoolingrateonthethermal,, MaterialsScience&EngineeringA, ----, 658
2015
研討會
抗菌技術應用於現代化家禽養殖場設備之研發, 科技部工程司104年度機械固力、熱流、能源學門聯合成果發表會, 高雄, 中華民國
研討會
抗菌技術應用於現代化家禽養殖場設備之研發, 104年度工程技術發展處「技術及知識應用型產學合作計畫成果發表暨績效考評會議, 台中, 中華民國
研討會
低溫複合銅導電膏應用於矽基太陽能電池之研究, 材料年會, 高雄, 中華民國
獲獎
2015年台北國際發明暨技術交易展 金牌, 經濟部國際貿易局, 中華民國
獲獎
2015年台北國際發明暨技術交易展 金牌, 經濟部國際貿易局, 中華民國
獲獎
104年度教師研發成果競賽優良?, 國立屏東科技大學, 中華民國
獲獎
104年度教師研發成果競賽優良?, 國立屏東科技大學, 中華民國
獲獎
104年度技術及知識應用型產學合作計畫成果發表暨績效考評會-海報展示優良獎, 科技部, 中華民國
獲獎
104年度技術及知識應用型產學合作計畫成果發表暨績效考評會-海報展示優良獎, 科技部, 中華民國
獲獎
103年學年度研究生研究成果獎勵獎, 屏東科技大學, 中華民國
獲獎
103年學年度研究生研究成果獎勵獎, 屏東科技大學, 中華民國
期刊
Plastic flow behavior, microstructure, and corrosion behavior of AZ61 Mg alloy during hot compression deformation , Journal of Manufacturing Processes, ----, 18
期刊
Effect of TiO2 nanoparticle addition and cooling rate on microstructure and mechanical properties of novel Sn1.5Sb0.7Cu solders , Journal of Materials Science - Materials in Electronics, ----, 26
期刊
Effect of Sn addition on the corrosion behavior of Ti-7Cu-Sn cast alloys for biomedical applications, Materials Science and Engineering C, ----, 46
期刊
Effect of 0.5 wt% nano-TiO2 addition into low-Ag Sn0.3Ag0.7Cu solder on the intermetallic growth with Cu substrate during isothermal aging, Journal of Materials Science - Materials in Electronics, ----, 26
2013
期刊
The influences of chromium addition and quenching treatment on the mechanical properties and fracture behaviors of diffusion-alloyed powder metal steels, Materials Science and Engineering: A, elsevier, 565, 196-202
期刊
Direct activesolderingofmicro-arcoxidizedTi/Tijointsinairusing
Sn3.5Ag0.5Cu4Ti(RE)filler, MaterialsScience&EngineeringA, MaterialsScience&Eng, 63-71
期刊
Direct active soldering of micro-arc oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE)filler, Materials Science & Engineering A, Elsevier, 565, 63-71
2012
期刊
The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu-0.5Al2O3 composite solder/Cu interface during soldering reaction, J Mater Sci: Mater Electron, Springer, 23, 100-107
期刊
The effects of alloying elements and microstructure on the impact toughness of powder metal steels, Materials Science and Engineering A, 538, 135-144
期刊
Prediction of package warpage combined experimental and simulation for four maps substrate, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, IEEE, 576-581
期刊
Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder, Materials Science and Engineering A, Elsevier, 545, 194-200
期刊
Growth kinetics of the intermetallic compounds during the interfacial reactions between Sn3.5Ag0.9Cu-nanoTiO2 alloys and Cu substrate, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, IEEE, 190-194
期刊
Flow stress behavior of commercial pure titanium sheet during warm tensile deformation, Materials & Design, Elsevier, 34, 179-184
期刊
Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging, Materials & Desig, 39, 475-483
期刊
Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder, Materials Science & Engineering A, 558, 478-484
期刊
Effect of TiO2 nanoparticles on the microstructure and bonding strengths of Sn0.7Cu composite solder BGA packages with immersion Sn surface finish, J Mater Sci: Mater Electron, Springer, 23, 681-687
期刊
Direct robust active bonding between Al heat sink and Si substrate, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE, 2012, 1635-1638
期刊
Corrosion characterization of Cu–Sn intermetallics in 3.5 wt.% NaCl solution, Corrosion Science, 63, 393-398
期刊
Brazing of 6061 aluminum alloy/Ti–6Al–4V using Al–Si–Cu–Ge filler metals, Journal of Materials Processing Technology, Elsevier, 212, 8-14
期刊
Basic Electrochemical Behavior of Ti-7Cu Alloys for Medical Applications, Acta physica polonica A, 122, 561-564
期刊
Age hardening reaction of the Al0.3CrFe1.5MnNi0.5 high entropy alloy, Materials & Design, 36, 854-858
期刊
新型旋轉攪拌精煉技術對鎂合金熔湯除氣精煉的影響, 鑄造工程學刊, 台灣鑄造學會, 152, 32-38
期刊
Suppressing effect of 1 wt.% nano-TiO2 addition into low Ag content Sn-Ag-Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE, 2012, 465-468
期刊
Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder, Materials Science and Engineering A , 558, 478-484
專書
曹龍泉*, Corrosion resistance, Intech, 1, ISBN: 979-953-307-264-6
2011
研討會
馮立平, 鄭得賢, 張世穎, 曹龍泉*, 鈦對無鉛Sn3.5Ag0.5CuXTi 銲錫在3.5wt.%鹽水腐蝕行為, 中華民國防蝕工程學會 100 年度防蝕工程年會暨論文發表會, 台北, 中華民國, 1-6
研討會
陳勁昕, 曹龍泉*, 梁智創, 方俊仁, 郭為元, 熱浸鍍鋅鋼之合金化鍍層的組織和生長動力學研究, 2011 兩岸綠色暨防災科技學術研討會, 屏東, 中華民國, 1-5
研討會
鐘健豪, 李佳言*, 曹龍泉, 電磁式微型幫浦之設計與製作, 2011 兩岸綠色暨防災科技學術研討會 屏東科技大學/北京科技大學第六屆學術交流研討會, 屏東, 中華民國, 1-5
研討會
羅宇盛, 陳柏安, 方俊仁, 曹龍泉, 梁智創*, 含化學反應之熱浸鍍鋅槽數值分析, 中國機械工程學會第二十八屆全國學術研討會, 台中, 中華民國, 1-6
研討會
曹龍泉*, 陳勁昕, 王富生, 添加微量TiO2奈米顆粒對Sn0.7Cu球格陣列構裝微結構和接合強度影響, 2011 兩岸綠色暨防災科技學術研討會, 屏東, 中華民國, 1-4
研討會
曹龍泉*, 鄭德賢, 馮立平, 楊漢暐, 新型旋轉攪拌精煉技術對鎂合金熔湯除氣精煉的影響, 台灣鑄造學會100年度論文發表會, 高雄, 中華民國, 1-7
研討會
曹龍泉*, Electrochemical behavior of Ti-7Cu Alloys for medical applications, 12 th International symposium on Physica of Materials (ISPMA12), 布拉格, 中華民國, 1-9
期刊
Suppressing effect of 0.5 wt.% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging, Journal of Alloys and Compounds, Elsevier, 509, 8441-8448
期刊
Study of interfacial reactions between Sn3.5Ag0.5Cu composite alloys and Cu substrate, Microelectronic Engineering, Elsevier, 88, 2964-2969
期刊
Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder, J Mater Sci: Mater Electron, springer, 22, 1021-1027
期刊
Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag
substrates, Journal of Materials Science: Materials in Electronics, Springer, 22, 1181-1187
期刊
Influence of Nano-TiCh Reinforcements on the Wettability and Interfacial Reactions of Novel Lead-Free Sn3.5AgO.5Zn Composite Solder/Cu Solder Joints, 2011 International Conference on Electronic Packaging Technology & High Density Packaging, 260-263
期刊
Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering, Journal of Alloys and Compounds, Elsevier, 509, 2326-2333
期刊
Effect of nano-TiO2 addition on the microstructure and bonding
strengths of Sn3.5Ag0.5Cu composite solder BGA packages
with immersion Sn surface finish, J Mater Sci: Mater Electron, Springer, 22, 1443-1449
期刊
Effect of addition of TiO2 nanoparticles on the microstructure, microhardness
and interfacial reactions of Sn3.5AgXCu solder, Materials and Design, Elsevier, 32, 4720-4727
期刊
Effect of Al203 Addition in Sn-Ag-Cu Solder Balls on the Microstructure and Shearing Strength of BGA Packages with Immersion Sn Surface Finish, 2011 International Conference on Electronic Packaging Technology & High Density Packaging, 374-378
期刊
An investigation of microstructure and mechanical properties of novel
Sn3.5Ag0.5Cu–XTiO2 composite solders as functions of alloy composition and
cooling rate, Materials Science and Engineering A, 529, 41-48
期刊
添加Ti元素對無鉛銲錫Sn3.5Ag0.5Cu 合金顯微組織及微硬度之影響, 鑄造工程學刊, 台灣鑄造學會, 29-34
2010
研討會
張世穎*, 曹龍泉, 柯懿原, 李俊彥, 以Sn-3Ag-0.5Cu-4Ti軟銲合金接合6061鋁合金與AZ31鎂合金之研究, 台灣鎂合金協會99年度會員大會暨論文發表會, 高雄., 中華民國
研討會
傅基容, 洪瑞晟, 張世穎*, 曹龍泉, 蕭威典, 熱噴塗鋁合金對鈦-鋁爆炸接合複合板之表面改質研究,, 中國機械工程學會第二十七屆全國學術研討會, 台北市, 北科大. , 中華民國
研討會
曹龍泉, 林裕凱, 張世穎*, 劉仕華, 添加鎂合金之軟銲填料應用於氧化鋁陶瓷與不鏽鋼接合研究, 2010中國材料科學學會年會, 高雄, 義守大學., 中華民國
研討會
曹龍泉, 許益誠*, 胡志得, 林雨利, 陳祈諺, 以側向研磨法製作光纖感測器及深度與粗糙度參數探討, 2010 北京科技大學暨屏東科技大學第五屆學術交流研討會, 中華民國
研討會
曹龍泉*, 朱中平, 彭紹凡, 高熵Al0.3CrFeMnNi合金在3.5wt.%NaCl水溶液中之腐蝕行為, 2010 北京科技大學暨屏東科技大學第五屆學術交流研討會, 中華民國
研討會
曹龍泉*, 張世穎, 彭紹凡, 黃建芯, 蕭威典, AZ31鎂合金熱噴塗鋁塗層之腐蝕行為, 中華民國防蝕工程學會 99 年度防蝕工程年會暨論文發表會, 中華民國, 1-5
研討會
曹龍泉*, 張世穎, 彭劭凡, 黃建芯, 商業純鈦微弧氧化陶瓷層顯微組織之研究, 2010 北京科技大學暨屏東科技大學第五屆學術交流研討會, 北京, 中華民國
研討會
曹龍泉*, 3Design珠寶設計軟體在時尚珠寶設計的應用-以台灣油桐花項鍊為例, 2010 現代設計國際學術研討會 論文集, 中華民國
研討會
曹龍泉*, 台灣意象紋飾在現代首飾設計的應用—以珠光鳳蝶造型元素為例, 2010 北京科技大學暨屏東科技大學第五屆學術交流研討會, 中華民國
期刊
Stress-corrosion cracking susceptibility of AZ31 alloy after varied heat-treatment in 3.5 wt.% NaCl solution, International Journal of Materials Research, International Journal of Materials Research, 101, 1166-1171
期刊
Electrochemical Behavior of a New Sn3.5Ag0.5Cu Composite Solder, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, IEEE, 1013-1017
期刊
Electrochemical Behavior of a New Sn3.5Ag0.5Cu Composite Solder, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, 1013-1017
期刊
Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder, Materials and Design , Elsevier, 31, 4831-4835
期刊
Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder, Materials and Design, 31, 990-993
期刊
Effect of Nano-TiO2 Addition on Wettability and Interfacial Reactions of Sn0.7Cu Composite Solder/Cu Solder Joints, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, IEEE, 250-253
期刊
以Sn-3Ag-0.5Cu-4Ti軟銲合金接合6061鋁合金與AZ31鎂合金之研究, 鎂合金產業通訊 , 鎂合金產業通訊 , 51, 51-56
2009
研討會
許志道, 曹龍泉, 張世穎*, 江俊憲, 氧化鋁陶瓷封接之無電鍍鎳金屬化製程研究, 台灣真空學會年會2009年論文研討會, 中華民國
研討會
曹龍泉, 張世穎*, 楊振昇, 趙俊任, 雷衍桓, Bi-Sn-In-Ti 低熔點銲錫合金接合透明導電性陶瓷
濺鍍靶材與銅背板, 台灣真空學會年會2009年論文研討會, 中華民國
研討會
曹龍泉, 張世穎*, 柯懿原, 李俊彥, 稀土元素之軟銲填料接合鎂合金與鋁合金研究, 2009台灣金屬熱處理學會2009年論文研討會, 中華民國
研討會
曹龍泉*, 翁仲毅, 林劉龍鎧, 彩色陽極處理應用於鈦合金時尚飾品之研究, 2009『屏東科技大學』暨『北京科技大學』第四屆學術交流研討會, 屏東, 中華民國, 142-146
研討會
曹龍泉*, 翁仲毅, 沈芮羽, 南台灣文化創意時尚首飾行銷策略之可行性探討, 2009『屏東科技大學』暨『北京科技大學』第四屆學術交流研討會, 屏東, 中華民國, 136-141
研討會
曹龍泉*, 林劉龍鎧, 孫瑋宏, 商業純鈦在3.5wt.%HCl水溶液中之腐蝕行為, 2009『屏東科技大學』暨『北京科技大學』第四屆學術交流研討會, 屏東, 中華民國, 140-143
研討會
曹龍泉*, 張世穎, 孫瑋宏, 顏秀芳, Study of Interfacial Reactions between Sn3.5Ag0.5Cu Alloys and Cu Substrate, 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 北京, 中華民國, 886-889
研討會
曹龍泉*, 孫瑋宏, 簡朝棋, 時效對添加Nano-TiO 2於SnAgCu合金與銅基板間介金屬化合物成長之影響, 2009『屏東科技大學』暨『北京科技大學』第四屆學術交流研討會, 屏東, 中華民國, 136-139
研討會
曹龍泉*, 孫瑋宏, 汽車用綠色環保AZ31鎂合金板材的溫拉伸流變行為, 2009海峽兩岸現代工程科技應用研討會Across the Taiwan Straits Conference on Application of modern engineering Technologiess (ATSCAMET2009), 嘉義, 中華民國, 65-68
研討會
曹龍泉*, Microstructure and mechanical properties of AZ31 magnesium
alloy during different heat treatment, 8th international conference on magnesium alloys and their applications, 威碼, 中華民國, 818-823
研討會
曹龍泉*, Cu 6 Sn 5相在3.5wt.%NaCl水溶液中之腐蝕特性, 2009『屏東科技大學』暨『北京科技大學』第四屆學術交流研討會, 屏東, 中華民國, 133-135
研討會
曹龍泉*, Corrosion Characterization of Sn37Pb Solders and With Cu Substrate
Soldering Reaction in 3.5wt.% NaCl Solution, 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 北京, 中華民國, 1164-1166
研討會
曹龍泉*, 鎂合金旋轉葉輪除氣技術之水模擬研究, 2009『屏東科技大學』暨『北京科技大學』第四屆學術交流研討會, 屏東, 中華民國, 144-148
研討會
曹龍泉*, 細小晶粒與粗大晶粒對綠色環保AZ31鎂合金之變形機構的影響, 2009海峽兩岸現代工程科技應用研討會Across the Taiwan Straits Conference on Application of modern engineering Technologiess (ATSCAMET2009), 嘉義, 中華民國, 204-207
獲獎
萬潤2009創新創意競賽, 崑山科技大學, 中華民國
期刊
Study of interfacial reactions between Sn3.5Ag0.5Cu alloys and Cu substrate, 2009 International Conference on Electronic Packaging Technology and High Density Packaging,, 886-889
期刊
Joining 6061 aluminum alloy with Al–Si–Cu filler metals, Journal of Alloys and Compounds, 488, 1, 174-180
期刊
Corrosion characterization of Sn37Pb solders and with cu substrate soldering reaction in 3.5wt.% NaCl solution, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HD, 1164-1166
期刊
田口設計優化的鋁合金旋轉葉輪除氣技術, 鑄造, 58, 1216-1219
期刊
新興科技融入高職專題製作課程研發-以精密鑄造為例, 鑄造科技, 242, 20-27
2008
研討會
曹龍泉*, 新興科技融入高職專題製作課程研發—以精密鑄造為例, 台灣鑄造學會論文發表會, 台南, 中華民國, 1-11
研討會
曹龍泉*, 問題導向學習策略在新興科技融入高職專題製作課程之應用, 2008科技教育課程改革與發展學術研討會2008 International Conference: Curriculum & Instruction in Technology Education , 高雄, 中華民國
期刊
Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads, Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads, 17, 1, 134-140
期刊
Effects of new materials and new technologies in modern jewelry, J. Tai. Found. Soc.,, 34, 6, 26-31
期刊
Active soldering of ZnS-SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal, J Mater. Process Technol.,, 202, 1-3, 22-26
期刊
新興科技融入高職專題製作課程之研發, 南港高工學報, 26, 1-24
2007
期刊
3Design參數化珠寶設計軟體在珠寶設計之應用與教學之研究, 南港高工學報, 25, 15-24
2006
期刊
Active soldering of ITO to copper, Welding J., 85, 4, 81-83
期刊
整合時尚藝術美學與3D數位科技–以珠寶設計與製造為例, 南港高工學報, 24, 361-371
2005
期刊
A Study of Microstructure and High Aspect Ratio of Sn-36Pb-2Ag Alloy by Microcasting Technique, J. Tai. Found. Soc., 31, 2, 16-22
2004
期刊
高中職社區化創意課程–「琉璃藝術」, 南港高工學報, 22, 49-67
2003
期刊
Stress-Corrosion Cracking Behavior of AZ31 alloy in 3.5wt. % NaCl Solution, J. Chin. Corr. Eng., 17, 4, 391-396
期刊
Morphology and Kinetics of Discontinuous Precipitation and Dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C Alloy, Metall. and Meter. Trans. A, 34, 1, 25-31
期刊
Intermetallic Compounds Formed During the Reflow of In-49Sn Solder Ball Array Packages, Journal of Electronic Materials, 3, 3, 195-200
期刊
Anodic Surface Coloring Treatment for a superplastic Zn-22wt.% Al Alloy, J. Chin. Corr. Eng, 17, 2, 145-151
期刊
Active Soldering of Indium Tin Oxide (ITO) with Cu in Air using an Sn3.5Ag4Ti(Ce,Ga) Filler, J. Mater. Eng. Perf., 12, 4, 383-389
期刊
透明導電ITO膜濺鍍靶材與其銅背板之低溫活性軟銲接合, welding and Cutting, 1, 15-18
2002
期刊
Morphology and Growth Kinetics of Ag3Sn during Soldering Reaction between Liquid Sn and an Ag Substrate, J. Mater. Eng. Perf., 11, 4
期刊
Intermetallic Compounds Formed during the interfacial Reactions of Liquid Sn and Sn-3.5Ag Solders with Ag Thick Films, J. Mater. Eng. Perf., 11, 5, 481-486
期刊
Intermetallic Compounds Formed During the Reflow of In-49Sn Solder Ball Array Packages, Journal of Electronic Materials., 32, 3, 185-200
期刊
Forming and Bonding Microchannels for the Manufacture of IC Chip Heat Dissipators, J. Mater. Sci. Eng, 34, 2, 73-78
期刊
Evaluation of the Formability of Plastic/Zn22Al/Plastic sandwiched Structure by Gas Blowing, Polymer Composites, 23, 6, 1036-1043
期刊
Effects of Zinc addition on the Microstructure and Melting Temperature of Al-Si-Cu Filler Metals, Mater. Character., 48, 341-346
期刊
Corrosion Behavior of Al-Si-Cu-(Sn, Zn) Brazing Filler Metals”,, Mater. Character., 47, 401-409
期刊
Corrosion Behavior of Al-Si-Cu Based Filler Metals and 6061-T6 Brazements, J. Mater. Eng. Perf, 11, 2, 187-193
期刊
Brazeability of a 3003 Aluminum Alloy with Al-Si-Cu Based Filler metals, J. Mater. Eng. Perf, 11, 4, 360-364
2001
期刊
The Utra-High Rate Superplastic Forming of a Zn-22Al Thin Sheet Material, Z. Metallkunde, 92, 1227-1230
期刊
Surface Self-Cleaning Effect of Zn-22Al Alloy during Superplastic Deformation, Z. Metallkunde, 92, 370-375
期刊
Evaluation of Superplastic Formability of the AZ31 Magnesium Alloy, Z. Metallkunde, 91, 572-577
期刊
Brazeability of the 6061-T6 Aluminum Alloy with Al-Si-20Cu-Based Filler Metals, J. Mater. Eng. Perf, 10, 6, 705-709
期刊
AgIn2 /Ag2In Transformations in an In-49Sn/Ag Soldered Joint under Thermal Aging, Journal of Electronic Materials, 30, 8, 945-950
專書
曹龍泉*, 精密鑄造種類與應用”, 精密鑄造職類能力本位訓練教材, 行政院勞工委員會職業訓練局, 0, ISBN: .
專書
曹龍泉*, 精密鑄造的特性 ”, 精密鑄造職類能力本位訓練教材, 行政院勞工委員會職業訓練局, 0, ISBN: .
專書
曹龍泉*, 檢查與整型蠟型 ”, 精密鑄造職類能力本位訓練教材, 行政院勞工委員會職業訓練局, 0, ISBN: .
專書
曹龍泉*, “精密鑄造與生活”, 精密鑄造職類能力本位訓練教材, 行政院勞工委員會職業訓練局, 0, ISBN: .
2000
期刊
Evaluation of Low Temperature Superplastic Formability for Zn-22Al Thin Sheets, Z. Metallkunde, 91, 613-617
期刊
Effects of Microstructures on Corrosion and Stress Corrosion Behavior of an Al-12.1at% Zn allo, J. Mater. Eng. Perf, 9, 396-401
期刊
Development of a Low-Melting-Point Filler Metal for Brazing Aluminum Alloys, Metall. and Meter. Trans. A, 31A, 2239-2245
1998
期刊
鋁合金除氣機構之研究, 北市南港高工學報, 16, 155-211