Improve Chip Side Wall Crack Issue in Nanometer Packing Process of Semiconductor.
鍾智超
鍾智超
Categories: Journal  /   SCI(Sciences Citation Index)  /  
Year2020
Author
Created date2021-09-05
Author orderFourth (above) author
Corresponding authorNo
Publication year2020
Publication month12
Journal nameIEEE Transactions on Components, Packaging and Manufacturing Technology
Publication area阿富汗伊斯蘭國
Volume11
Issue2
Start page173
End page180
Review systemYes
LanguageForeign Language