Chip-scale package構裝模組在溫度循環試驗下的結構應力模擬
吳德和
吳德和
Categories: Symposium  /  
Year2011
AuthorWu Der-Ho, Lu Wei-Hua*
Author count2
Created date2019-02-19
Author order1
Corresponding authorNo
Publication year2011
Symposium name 兩岸綠色暨防災科技學術研討會
Seminar cityPingtung
Seminar country中華民國
Start date2011-10-12
End date2011-10-12
Review systemNo
LanguageTraditional Chinese