Suppressing effect of 1 wt. % nano-Ti02 addition into low Ag content Sn-Ag-Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging
黃惟泰
黃惟泰
Categories: Journal  /   Chinese Journal (EI)  /  
Year2013
Author
Created date2019-02-19
Author orderSecond author
Corresponding authorNo
Publication year2013
Publication month3
Journal nameInternational Conference on Electronic Packaging Technology & High Density Packaging
Publication area中華民國
Issue(ICEPT-HDP)
Start page465
End page468
Review systemNo
LanguageForeign Language
Attached project