Effects of Nano-TiO2 Addition on the Microstructure and Bonding Strengths of Sn3.5Ag0.5Cu Composite Solder BGA Packages with Immersion Sn Surface Finish
梁茲程
College of Engineering Department of Vehicle Engineering International Master Degree Program in Food Science International Master Program in Soil and Water Engineering International Program in Ornamental Fish Science and Technology and Aquatic Animal Health International Degree Program in Animal Vaccine Technology
Professor
08-7703202#7468、(L)7605
jcleong@mail.npust.edu.tw
| Year | 2011 |
| Author | 梁茲程, 曹龍泉* |
| Author count | 2 |
| Created date | 2019-02-19 |
| Author order | 第一作者 |
| Corresponding author | 否 |
| Publication year | 2011 |
| Publication month | 9 |
| Journal name | Journal of Materials Science: Materials in Electronics |
| Publication area | 中華民國 |
| Volume | 21 |
| Start page | 1443 |
| End page | 1449 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |