Effect of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder
林鉉凱
林鉉凱
Categories: Journal  /   SCI(Sciences Citation Index)  /  
Year2012
Author
Created date2019-02-19
Author orderFirst author
Corresponding authorYes
Publication year2012
Publication month8
Journal nameMater. Sci. Eng. A
Publication area中華民國
Issue558
Start page478
End page484
Review systemNo
LanguageForeign Language
Attached project