研發績效

工學院材料工程系先進材料學士學位學程

期刊: 96 筆

獲獎: 13 筆

研討會: 55 筆

技術報告: 4 筆

專書: 7 筆

計畫案: 17 筆

2019

研討會曹龍泉*, Jewelry material–present and future, ISIC 2019 – International Seminar on Investment Casting, Taichung, 中華民國
研討會曹龍泉*, 超音波輔助活性接合製備7075鋁基-碳纖維金屬基積層板之研究, 科技部工程司108年度機械固力、熱流、能源學門聯合成果發表會 , 台北, 中華民國
專書曹龍泉*, Fillers – Synthesis, Characterization and Industrial Application, IntechOpen, Active Solders and Active Soldering, ISBN: 10.5772/intechopen.82382

2018

研討會黃彥樺, 張世穎, 林照凱, 曹龍泉*, Sn-8Zn-3Bi與Sn-8Zn-3Bi-4Ti-0.1Re合金在3.5wt.%NaCl水溶液中之電化學腐蝕行為研究, 107年度防蝕工程年會暨論文發表會(2018), 台東, 中華民國, 1-1
研討會曹龍泉*, Electrochemical behavior of Ti-Cu-Sn alloys in the 0.2 wt.%NaF mouthwashes, 29th Annual Meeting of the European Society for Biomaterials, 9/9–13, Maastricht, 荷蘭王國, 1-4
研討會曹龍泉*, A study of direct writing the low-melting-point In-based active alloy ink to directly make a solidified circuit, 科技部工程司機械固力、熱流與能源學門聯合成果發表會, 嘉義, 中華民國, 1-1
研討會楊州斌, 曹龍泉*, 呂宗炫, 蔡雅竹, 余勇慶, 張世穎, AZ31鎂合金熱噴塗鋁塗層之腐蝕行為, 107年度防蝕工程年會暨論文發表會, 台東, 中華民國, 1-1
研討會 The study of toner on the moisturizing skin by use differences between skin activating apparatus makeup and traditional makeup, 2018 International Conference on Interdisciplinary Design and Industrial-Academic Collaboration,, Kaohsiung, 中華民國, 1-8
獲獎 107年學年度研究生研究成果獎勵獎, 屏東科技大學, 中華民國
期刊 C. L. Chuang, 曹龍泉*, Effects of nanoparticles on the thermal, microstructural and mechanical properties of novel Sn3.5Ag0.5Zn composite solders, Journal of Materials Science: Materials in Electronics, SPRINGER, 29, 4096-4105
期刊曹龍泉*, 謝明哲, 余勇慶（學生）, Effects of Sn additions on microstructure and corrosion resistance of heat-treated Ti–Cu–Sn titanium alloys, Corrosion Engineering, Science and Technology , TAYLOR & FRANCIS, 53, 252-258
期刊曹龍泉*, 張世穎, 余勇慶（學生）, Direct active soldering of Al0.3CrFe1.5MnNi0.5 high entropy alloy to 6061-Al using Sn−Ag−Ti active solder, Trans. Nonferrous Met. Soc. China, Elsevier, 28, 748-756
期刊曹龍泉*, Effects of applied voltage on the microstructure and properties of hydroxyapatite bioceramic coatings formed on Ti7Cu5Sn titanium alloy by micro-arc oxidation, Corrosion Engineering, Science and Technology , TAYLOR & FRANCIS, 53, 528-590

2017

研討會曹龍泉*, 新型無鉛Cu5SixSn青銅合金應用於銅鐘之研發, 106年度工程技術發展處「技術及知識應用型產學合作計畫成果發表暨績效考評會議, 台南, 中華民國, 1-1
研討會 Preparation and characterization of biomimetically and electrochemically deposited hydroxyapatite coatings on micro-arc oxidized Ti-7Cu-5Sn, 2016台灣鍍膜科技協會年會(TACT 2016)暨科技部專題計畫研究成果發表會論文集, 屏東, 中華民國
研討會 Effects of different electrolyte systems on microstructure, corrosion behavior and antibacterial properties of micro-arc oxidation ceramic coatings of commercially pure titanium, 2016台灣鍍膜科技協會年會(TACT 2016)暨科技部專題計畫研究成果發表會論文集, 屏東, 中華民國
研討會 Effect of tio2 nanoparticles on the corrosion property of novel Sn3.5Ag0.5Bi solders, 4th world congress and expo on nanotechnology & Materials Science, Barcelona, 西班牙王國
研討會 Effect of Microstructure on the Performance of a LA92 Alloy Anode for Mg-Air Battery Application, International Conference on Advances in Functional Materials, LA, 美國
期刊 Influences of argon plasma cleaning on the die-shear force of chip and copper/polyimide flexible substrate assembly using a non-conductive film, Journal of the Chinese Institute of Engineers, ----, 33
期刊 Influence of Cu addition on the structures and properties of Ti15SnxCu alloys, Materials science and technology, ----, 33
期刊 Effects of Cu addition on the microstructure and mechanical properties of Ti15Sn alloys, Materials Science & Engineering A, ----, 698

2016

研討會 Preparation and characterization of biomimetically and electrochemically deposited hydroxyapatite coatings on micro-arc oxidized Ti-7Cu-5Sn, 2016台灣鍍膜科技協會年會(TACT 2016)暨科技部專題計畫研究成果發表會, 屏東, 中華民國
研討會 Effects of different electrolyte systems on microstructure, corrosion behavior and antibacterial properties of micro-arc oxidation ceramic coatings of commercially pure titanium, 2016台灣鍍膜科技協會年會(TACT 2016)暨科技部專題計畫研究成果發表會, 屏東, 中華民國
研討會鎂合金作為鎂燃料電池陽極材料的性能研究, 2016第十一屆全國氫能與燃料電池學術研討會暨第三屆台灣能源學會年會, 台北, 中華民國
研討會以Ｓn-Ag-Cu-Ti活性銲料直接活性接合6061 Al/MAO-6061Al, 2016年台灣陶瓷學會年會暨科技部專題研究計畫成果發表會, 屏東, 中華民國
期刊 Selective electrode patterning of ITO films using pulsed, Opt Quant Electron, ----, 48
期刊 Active soldering of aluminum–graphite composite to aluminum using Sn3.5Ag4Ti0.5Cu active filler, Int. J. Mater. Res., ----, 107
期刊 “Effect ofnano-TiO2 particles andcoolingrateonthethermal,, MaterialsScience&EngineeringA, ----, 658

2015

研討會抗菌技術應用於現代化家禽養殖場設備之研發, 科技部工程司104年度機械固力、熱流、能源學門聯合成果發表會, 高雄, 中華民國
研討會抗菌技術應用於現代化家禽養殖場設備之研發, 104年度工程技術發展處「技術及知識應用型產學合作計畫成果發表暨績效考評會議, 台中, 中華民國
研討會低溫複合銅導電膏應用於矽基太陽能電池之研究, 材料年會, 高雄, 中華民國
獲獎 2015年台北國際發明暨技術交易展金牌, 經濟部國際貿易局, 中華民國
獲獎 2015年台北國際發明暨技術交易展金牌, 經濟部國際貿易局, 中華民國
獲獎 104年度教師研發成果競賽優良?, 國立屏東科技大學, 中華民國
獲獎 104年度教師研發成果競賽優良?, 國立屏東科技大學, 中華民國
獲獎 104年度技術及知識應用型產學合作計畫成果發表暨績效考評會-海報展示優良獎, 科技部, 中華民國
獲獎 104年度技術及知識應用型產學合作計畫成果發表暨績效考評會-海報展示優良獎, 科技部, 中華民國
獲獎 103年學年度研究生研究成果獎勵獎, 屏東科技大學, 中華民國
獲獎 103年學年度研究生研究成果獎勵獎, 屏東科技大學, 中華民國
期刊 Plastic flow behavior, microstructure, and corrosion behavior of AZ61 Mg alloy during hot compression deformation , Journal of Manufacturing Processes, ----, 18
期刊 Effect of TiO2 nanoparticle addition and cooling rate on microstructure and mechanical properties of novel Sn1.5Sb0.7Cu solders , Journal of Materials Science - Materials in Electronics, ----, 26
期刊 Effect of Sn addition on the corrosion behavior of Ti-7Cu-Sn cast alloys for biomedical applications, Materials Science and Engineering C, ----, 46
期刊 Effect of 0.5 wt% nano-TiO2 addition into low-Ag Sn0.3Ag0.7Cu solder on the intermetallic growth with Cu substrate during isothermal aging, Journal of Materials Science - Materials in Electronics, ----, 26

2013

期刊 Ming-Wei Wu, 曹龍泉, Shih-YingChang*, The influences of chromium addition and quenching treatment on the mechanical properties and fracture behaviors of diffusion-alloyed powder metal steels, Materials Science and Engineering: A, elsevier, 565, 196-202
期刊曹龍泉*, Direct activesolderingofmicro-arcoxidizedTi/Tijointsinairusing Sn3.5Ag0.5Cu4Ti(RE)filler, MaterialsScience&EngineeringA, MaterialsScience&Eng, 63-71
期刊曹龍泉*, Direct active soldering of micro-arc oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE)filler, Materials Science & Engineering A, Elsevier, 565, 63-71

2012

期刊 T.H. Chuang, 曹龍泉*, Chien-Han Chung, S.Y. Chang, Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging, Materials & Desig, 39, 475-483
期刊 S.Y. Chang*, 曹龍泉, S.M. Mao, C.H. Huang, Brazing of 6061 aluminum alloy/Ti–6Al–4V using Al–Si–Cu–Ge filler metals, Journal of Materials Processing Technology, Elsevier, 212, 8-14
期刊 S. Y. Chang, 曹龍泉*, M. W. Wu, C. W. Chen, The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu-0.5Al2O3 composite solder/Cu interface during soldering reaction, J Mater Sci: Mater Electron, Springer, 23, 100-107
期刊 M.W. Wu*, 曹龍泉, G.J. Shu, B.H. Lin, The effects of alloying elements and microstructure on the impact toughness of powder metal steels, Materials Science and Engineering A, 538, 135-144
期刊 C.L. Chuang, 曹龍泉*, H.K. Lin, L.P. Feng, Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder, Materials Science & Engineering A, 558, 478-484
期刊曹龍泉*, 鄭德賢, 馮立平, 新型旋轉攪拌精煉技術對鎂合金熔湯除氣精煉的影響, 鑄造工程學刊, 台灣鑄造學會, 152, 32-38
期刊曹龍泉*, 張世穎, Meng-Syuan, Huang, C. S. Chen, Direct robust active bonding between Al heat sink and Si substrate, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE, 2012, 1635-1638
期刊曹龍泉*, W.T.Huang, 吳明偉, Sheng-Lung, Su, Suppressing effect of 1 wt.% nano-TiO2 addition into low Ag content Sn-Ag-Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE, 2012, 465-468
期刊曹龍泉*, T. T. Lo, S. F. Peng, Growth kinetics of the intermetallic compounds during the interfacial reactions between Sn3.5Ag0.9Cu-nanoTiO2 alloys and Cu substrate, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, IEEE, 190-194
期刊曹龍泉*, M. W. Wu, S. Y. Chang, Effect of TiO2 nanoparticles on the microstructure and bonding strengths of Sn0.7Cu composite solder BGA packages with immersion Sn surface finish, J Mater Sci: Mater Electron, Springer, 23, 681-687
期刊曹龍泉*, H.Y. Wu, J.C. Leong, C.J. Fang, Flow stress behavior of commercial pure titanium sheet during warm tensile deformation, Materials & Design, Elsevier, 34, 179-184
期刊曹龍泉*, C.S. Chen, C.P. Chu, Age hardening reaction of the Al0.3CrFe1.5MnNi0.5 high entropy alloy, Materials & Design, 36, 854-858
期刊曹龍泉*, C.H. Huang, R.S. Chen, Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder, Materials Science and Engineering A, Elsevier, 545, 194-200
期刊曹龍泉*, Prediction of package warpage combined experimental and simulation for four maps substrate, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, IEEE, 576-581
期刊曹龍泉*, Corrosion characterization of Cu–Sn intermetallics in 3.5 wt.% NaCl solution, Corrosion Science, 63, 393-398
期刊曹龍泉*, Basic Electrochemical Behavior of Ti-7Cu Alloys for Medical Applications, Acta physica polonica A, 122, 561-564
期刊曹龍泉*, Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder, Materials Science and Engineering A , 558, 478-484
專書曹龍泉*, Corrosion resistance, Intech, 1, ISBN: 979-953-307-264-6

2011

研討會馮立平, 鄭得賢, 張世穎, 曹龍泉*, 鈦對無鉛Sn3.5Ag0.5CuXTi 銲錫在3.5wt.％鹽水腐蝕行為, 中華民國防蝕工程學會 100 年度防蝕工程年會暨論文發表會, 台北, 中華民國, 1-6
研討會陳勁昕, 曹龍泉*, 梁智創, 方俊仁, 郭為元, 熱浸鍍鋅鋼之合金化鍍層的組織和生長動力學研究, 2011 兩岸綠色暨防災科技學術研討會, 屏東, 中華民國, 1-5
研討會鐘健豪, 李佳言*, 曹龍泉, 電磁式微型幫浦之設計與製作, 2011 兩岸綠色暨防災科技學術研討會屏東科技大學/北京科技大學第六屆學術交流研討會, 屏東, 中華民國, 1-5
研討會羅宇盛, 陳柏安, 方俊仁, 曹龍泉, 梁智創*, 含化學反應之熱浸鍍鋅槽數值分析, 中國機械工程學會第二十八屆全國學術研討會, 台中, 中華民國, 1-6
研討會曹龍泉*, 陳勁昕, 王富生, 添加微量TiO2奈米顆粒對Sn0.7Cu球格陣列構裝微結構和接合強度影響, 2011 兩岸綠色暨防災科技學術研討會, 屏東, 中華民國, 1-4
研討會曹龍泉*, 鄭德賢, 馮立平, 楊漢暐, 新型旋轉攪拌精煉技術對鎂合金熔湯除氣精煉的影響, 台灣鑄造學會100年度論文發表會, 高雄, 中華民國, 1-7
研討會曹龍泉*, Electrochemical behavior of Ti-7Cu Alloys for medical applications, 12 th International symposium on Physica of Materials (ISPMA12), 布拉格, 中華民國, 1-9
期刊莊東漢, 吳克偉, 張世穎, 彭紹凡, 曹龍泉*, Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder, J Mater Sci: Mater Electron, springer, 22, 1021-1027
期刊朱中平, 曹龍泉*, 添加Ti元素對無鉛銲錫Sn3.5Ag0.5Cu 合金顯微組織及微硬度之影響, 鑄造工程學刊, 台灣鑄造學會, 29-34
期刊張世穎, 簡朝棋, 莊東漢, 馮立平（學生）, 曹龍泉*, Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder, Materials and Design, Elsevier, 32, 4720-4727
期刊 T. H. Cheng, 曹龍泉*, F. S. Wang, W. Y. Kuo, Effect of Al203 Addition in Sn-Ag-Cu Solder Balls on the Microstructure and Shearing Strength of BGA Packages with Immersion Sn Surface Finish, 2011 International Conference on Electronic Packaging Technology & High Density Packaging, 374-378
期刊 R. W. Wu, 曹龍泉*, S. Y. Chang, C. C. Jain, R. S. Chen, Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates, Journal of Materials Science: Materials in Electronics, Springer, 22, 1181-1187
期刊 L. P. Feng, S. Y. Chang, 曹龍泉*, F. S. Wang, Influence of Nano-TiCh Reinforcements on the Wettability and Interfacial Reactions of Novel Lead-Free Sn3.5AgO.5Zn Composite Solder/Cu Solder Joints, 2011 International Conference on Electronic Packaging Technology & High Density Packaging, 260-263
期刊曹龍泉*, C.P. Chu,, S.F. Peng, Study of interfacial reactions between Sn3.5Ag0.5Cu composite alloys and Cu substrate, Microelectronic Engineering, Elsevier, 88, 2964-2969
期刊曹龍泉*, Suppressing effect of 0.5 wt.% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging, Journal of Alloys and Compounds, Elsevier, 509, 8441-8448
期刊曹龍泉*, Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering, Journal of Alloys and Compounds, Elsevier, 509, 2326-2333
期刊曹龍泉*, An investigation of microstructure and mechanical properties of novel Sn3.5Ag0.5Cu–XTiO2 composite solders as functions of alloy composition and cooling rate, Materials Science and Engineering A, 529, 41-48
期刊梁茲程, 曹龍泉*, C. J. Fang, C. P. Chu, Effect of nano-TiO2 addition on the microstructure and bonding strengths of Sn3.5Ag0.5Cu composite solder BGA packages with immersion Sn surface finish, J Mater Sci: Mater Electron, Springer, 22, 1443-1449

2010

研討會張世穎*, 曹龍泉, 柯懿原, 李俊彥, 以Sn-3Ag-0.5Cu-4Ti軟銲合金接合6061鋁合金與AZ31鎂合金之研究, 台灣鎂合金協會99年度會員大會暨論文發表會, 高雄., 中華民國
研討會傅基容, 洪瑞晟, 張世穎*, 曹龍泉, 蕭威典, 熱噴塗鋁合金對鈦-鋁爆炸接合複合板之表面改質研究,, 中國機械工程學會第二十七屆全國學術研討會, 台北市, 北科大. , 中華民國
研討會曹龍泉, 林裕凱, 張世穎*, 劉仕華, 添加鎂合金之軟銲填料應用於氧化鋁陶瓷與不鏽鋼接合研究, 2010中國材料科學學會年會, 高雄, 義守大學., 中華民國
研討會曹龍泉, 許益誠*, 胡志得, 林雨利, 陳祈諺, 以側向研磨法製作光纖感測器及深度與粗糙度參數探討, 2010 北京科技大學暨屏東科技大學第五屆學術交流研討會, 中華民國
研討會曹龍泉*, 朱中平, 彭紹凡, 高熵Al0.3CrFeMnNi合金在3.5wt.%NaCl水溶液中之腐蝕行為, 2010 北京科技大學暨屏東科技大學第五屆學術交流研討會, 中華民國
研討會曹龍泉*, 張世穎, 彭紹凡, 黃建芯, 蕭威典, AZ31鎂合金熱噴塗鋁塗層之腐蝕行為, 中華民國防蝕工程學會 99 年度防蝕工程年會暨論文發表會, 中華民國, 1-5
研討會曹龍泉*, 張世穎, 彭劭凡, 黃建芯, 商業純鈦微弧氧化陶瓷層顯微組織之研究, 2010 北京科技大學暨屏東科技大學第五屆學術交流研討會, 北京, 中華民國
研討會曹龍泉*, 3Design珠寶設計軟體在時尚珠寶設計的應用－以台灣油桐花項鍊為例, 2010 現代設計國際學術研討會論文集, 中華民國
研討會曹龍泉*, 台灣意象紋飾在現代首飾設計的應用—以珠光鳳蝶造型元素為例, 2010 北京科技大學暨屏東科技大學第五屆學術交流研討會, 中華民國
期刊曹龍泉, 張世穎*, 雷衍桓, 柯懿原, 李俊彥, 以Sn-3Ag-0.5Cu-4Ti軟銲合金接合6061鋁合金與AZ31鎂合金之研究, 鎂合金產業通訊 , 鎂合金產業通訊 , 51, 51-56
期刊曹龍泉*, 張世穎, Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder, Materials and Design, 31, 990-993
期刊曹龍泉*, T. T. Lo, S. F. Peng, S. Y. Chang, Electrochemical Behavior of a New Sn3.5Ag0.5Cu Composite Solder, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, IEEE, 1013-1017
期刊曹龍泉*, T. T. Lo, S. F. Peng, S. Y. Chang, Electrochemical Behavior of a New Sn3.5Ag0.5Cu Composite Solder, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, 1013-1017
期刊曹龍泉*, S.Y. Chang, C.I. Lee, W.H. Sun, C.H. Huang, Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder, Materials and Design , Elsevier, 31, 4831-4835
期刊曹龍泉*, B. C. Wang, C. W. Chang, M. W. Wu, Effect of Nano-TiO2 Addition on Wettability and Interfacial Reactions of Sn0.7Cu Composite Solder/Cu Solder Joints, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, IEEE, 250-253
期刊曹龍泉*, Stress-corrosion cracking susceptibility of AZ31 alloy after varied heat-treatment in 3.5 wt.% NaCl solution, International Journal of Materials Research, International Journal of Materials Research, 101, 1166-1171

2009

研討會許志道, 曹龍泉, 張世穎*, 江俊憲, 氧化鋁陶瓷封接之無電鍍鎳金屬化製程研究, 台灣真空學會年會2009年論文研討會, 中華民國
研討會曹龍泉, 張世穎*, 楊振昇, 趙俊任, 雷衍桓, Bi-Sn-In-Ti 低熔點銲錫合金接合透明導電性陶瓷濺鍍靶材與銅背板, 台灣真空學會年會2009年論文研討會, 中華民國
研討會曹龍泉, 張世穎*, 柯懿原, 李俊彥, 稀土元素之軟銲填料接合鎂合金與鋁合金研究, 2009台灣金屬熱處理學會2009年論文研討會, 中華民國
研討會曹龍泉*, 翁仲毅, 林劉龍鎧, 彩色陽極處理應用於鈦合金時尚飾品之研究, 2009『屏東科技大學』暨『北京科技大學』第四屆學術交流研討會, 屏東, 中華民國, 142-146
研討會曹龍泉*, 翁仲毅, 沈芮羽, 南台灣文化創意時尚首飾行銷策略之可行性探討, 2009『屏東科技大學』暨『北京科技大學』第四屆學術交流研討會, 屏東, 中華民國, 136-141
研討會曹龍泉*, 林劉龍鎧, 孫瑋宏, 商業純鈦在3.5wt.%HCl水溶液中之腐蝕行為, 2009『屏東科技大學』暨『北京科技大學』第四屆學術交流研討會, 屏東, 中華民國, 140-143
研討會曹龍泉*, 張世穎, 孫瑋宏, 顏秀芳, Study of Interfacial Reactions between Sn3.5Ag0.5Cu Alloys and Cu Substrate, 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 北京, 中華民國, 886-889
研討會曹龍泉*, 孫瑋宏, 簡朝棋, 時效對添加Nano-TiO 2於SnAgCu合金與銅基板間介金屬化合物成長之影響, 2009『屏東科技大學』暨『北京科技大學』第四屆學術交流研討會, 屏東, 中華民國, 136-139
研討會曹龍泉*, 孫瑋宏, 汽車用綠色環保AZ31鎂合金板材的溫拉伸流變行為, 2009海峽兩岸現代工程科技應用研討會Across the Taiwan Straits Conference on Application of modern engineering Technologiess (ATSCAMET2009), 嘉義, 中華民國, 65-68
研討會曹龍泉*, Microstructure and mechanical properties of AZ31 magnesium alloy during different heat treatment, 8th international conference on magnesium alloys and their applications, 威碼, 中華民國, 818-823
研討會曹龍泉*, Cu 6 Sn 5相在3.5wt.％NaCl水溶液中之腐蝕特性, 2009『屏東科技大學』暨『北京科技大學』第四屆學術交流研討會, 屏東, 中華民國, 133-135
研討會曹龍泉*, Corrosion Characterization of Sn37Pb Solders and With Cu Substrate Soldering Reaction in 3.5wt.% NaCl Solution, 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 北京, 中華民國, 1164-1166
研討會曹龍泉*, 鎂合金旋轉葉輪除氣技術之水模擬研究, 2009『屏東科技大學』暨『北京科技大學』第四屆學術交流研討會, 屏東, 中華民國, 144-148
研討會曹龍泉*, 細小晶粒與粗大晶粒對綠色環保AZ31鎂合金之變形機構的影響, 2009海峽兩岸現代工程科技應用研討會Across the Taiwan Straits Conference on Application of modern engineering Technologiess (ATSCAMET2009), 嘉義, 中華民國, 204-207
獲獎萬潤2009創新創意競賽, 崑山科技大學, 中華民國
期刊張世穎, 曹龍泉, 李, 莊東漢*, Joining 6061 aluminum alloy with Al–Si–Cu filler metals, Journal of Alloys and Compounds, 488, 1, 174-180
期刊曹龍泉*, 欧炳隆, 田口設計優化的鋁合金旋轉葉輪除氣技術, 鑄造, 58, 1216-1219
期刊曹龍泉*, Chang, S.Y., Sun, W.H., Yen, S.F., Study of interfacial reactions between Sn3.5Ag0.5Cu alloys and Cu substrate, 2009 International Conference on Electronic Packaging Technology and High Density Packaging,, 886-889
期刊曹龍泉*, Corrosion characterization of Sn37Pb solders and with cu substrate soldering reaction in 3.5wt.% NaCl solution, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HD, 1164-1166
期刊曹龍泉*, 新興科技融入高職專題製作課程研發-以精密鑄造為例, 鑄造科技, 242, 20-27
專書曹龍泉*, Magnesium, DGM, 1, ISBN: 978-3-527-32732-4