Effects of Nano-TiO2 Addition on the Microstructure and Bonding Strengths of Sn3.5Ag0.5Cu Composite Solder BGA Packages with Immersion Sn Surface Finish
| Year | 2011 |
| Author | 梁茲程, 曹龍泉* |
| Author count | 2 |
| Created date | 2019-02-19 |
| Author order | 第一作者 |
| Corresponding author | 否 |
| Publication year | 2011 |
| Publication month | 9 |
| Journal name | Journal of Materials Science: Materials in Electronics |
| Publication area | 中華民國 |
| Volume | 21 |
| Start page | 1443 |
| End page | 1449 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |