Biblio – 曹龍泉 – 教師資訊公開查詢系統 Faculty Profile System

工學院材料工程系先進材料學士學位學程

Biblio

Journal: 96 Items

Prize: 13 Items

Symposium: 55 Items

Technology Report: 4 Items

Book: 7 Items

Project: 17 Items

2024

Journal Joining of SiO2 glass and substrate using In49Sn active solder in air,

2023

Symposium Effects of Heat Treatment on Microstructure evolution and Mechanical Properties of As-extruded LAZ1010 Alloys,

Journal Improved Mechanical and Corrosion Properties of Powder Metallurgy Austenitic, Ferritic, and Martensitic Stainless Steels by Liquid Phase Sintering,

2022

Symposium 添加石墨稀對鋅-空氣燃料電池之放電效率的影響,

Prize 2022 華立材料大賽,

Prize 全球前 2% 頂尖科學家榜單（World’s Top 2% Scientists 2020）-2020年科學影響力頂尖科學家,

Prize 全球前 2% 頂尖科學家榜單（World’s Top 2% Scientists 2020）「終身科學影響力排行榜（1960 – 2020）頂尖科學家,

2021

Journal Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper,

Journal Effects of Adding Active Elements to Aluminum-Based Filler Alloys on the Bonding of 6061 Aluminum Alloy and Alumina,

2020

Symposium Tsao Lung-Chuan*, Effects of different electrolyte systems on microstructure, corrosion behavior and antibacterial properties of micro-arc oxidation ceramic coatings of commercially pure titanium,

Symposium Tsao Lung-Chuan*, A Study on the Properties of Antibacterial Cu-Bearing 316 Stainless Steel,

Journal Effects of Different Electrolytes on Microstructure and Antibacterial Properties of Microarc Oxidized Coatings of CP-Ti,

Journal Effect of Heat Treatment Conditions on the Mechanical Properties and Machinability of Ti15SnxCu Alloys,

2019

Symposium Tsao Lung-Chuan*, Study on the 7075Al-based fiber metal laminates prepared by ultrasonic-aided active bonding,

Symposium Tsao Lung-Chuan*, Jewelry material–present and future,

Book Tsao Lung-Chuan*, Fillers – Synthesis, Characterization and Industrial Application,

2018

Symposium Tsao Lung-Chuan*, Electrochemical behavior of Ti-Cu-Sn alloys in the 0.2 wt.%NaF mouthwashes,

Symposium Tsao Lung-Chuan*, A study of direct writing the low-melting-point In-based active alloy ink to directly make a solidified circuit,

Symposium Yang Chou-Ping, Tsao Lung-Chuan*, , , , , –,

Symposium The study of toner on the moisturizing skin by use differences between skin activating apparatus makeup and traditional makeup,

Symposium , , , Tsao Lung-Chuan*, –,

Prize 107年學年度研究生研究成果獎勵獎,

Journal Effects of nanoparticles on the thermal, microstructural and mechanical properties of novel Sn3.5Ag0.5Zn composite solders,

Journal Effects of applied voltage on the microstructure and properties of hydroxyapatite bioceramic coatings formed on Ti7Cu5Sn titanium alloy by micro-arc oxidation,

Journal Effects of Sn additions on microstructure and corrosion resistance of heat-treated Ti–Cu–Sn titanium alloys,

Journal Direct active soldering of Al0.3CrFe1.5MnNi0.5 high entropy alloy to 6061-Al using Sn−Ag−Ti active solder,

2017

Symposium Tsao Lung-Chuan*, –,

Symposium Preparation and characterization of biomimetically and electrochemically deposited hydroxyapatite coatings on micro-arc oxidized Ti-7Cu-5Sn,

Symposium Effects of different electrolyte systems on microstructure, corrosion behavior and antibacterial properties of micro-arc oxidation ceramic coatings of commercially pure titanium,

Symposium Effect of tio2 nanoparticles on the corrosion property of novel Sn3.5Ag0.5Bi solders,

Symposium Effect of Microstructure on the Performance of a LA92 Alloy Anode for Mg-Air Battery Application,

Journal Influences of argon plasma cleaning on the die-shear force of chip and copper/polyimide flexible substrate assembly using a non-conductive film,

Journal Influence of Cu addition on the structures and properties of Ti15SnxCu alloys,

Journal Effects of Cu addition on the microstructure and mechanical properties of Ti15Sn alloys,

2016

Symposium Preparation and characterization of biomimetically and electrochemically deposited hydroxyapatite coatings on micro-arc oxidized Ti-7Cu-5Sn,

Symposium Effects of different electrolyte systems on microstructure, corrosion behavior and antibacterial properties of micro-arc oxidation ceramic coatings of commercially pure titanium,

Symposium 鎂合金作為鎂燃料電池陽極材料的性能研究,

Symposium 以Ｓn-Ag-Cu-Ti活性銲料直接活性接合6061 Al/MAO-6061Al,

Journal Selective electrode patterning of ITO films using pulsed,

Journal Active soldering of aluminum–graphite composite to aluminum using Sn3.5Ag4Ti0.5Cu active filler,

Journal “Effect ofnano-TiO2 particles andcoolingrateonthethermal,,

2015

Symposium 抗菌技術應用於現代化家禽養殖場設備之研發,

Symposium 抗菌技術應用於現代化家禽養殖場設備之研發,

Symposium 低溫複合銅導電膏應用於矽基太陽能電池之研究,

Prize 2015年台北國際發明暨技術交易展金牌,

Prize 2015年台北國際發明暨技術交易展金牌,

Prize 104年度教師研發成果競賽優良?,

Prize 104年度教師研發成果競賽優良?,

Prize 104年度技術及知識應用型產學合作計畫成果發表暨績效考評會-海報展示優良獎,

Prize 104年度技術及知識應用型產學合作計畫成果發表暨績效考評會-海報展示優良獎,

Prize 103年學年度研究生研究成果獎勵獎,

Prize 103年學年度研究生研究成果獎勵獎,

Journal Plastic flow behavior, microstructure, and corrosion behavior of AZ61 Mg alloy during hot compression deformation ,

Journal Effect of TiO2 nanoparticle addition and cooling rate on microstructure and mechanical properties of novel Sn1.5Sb0.7Cu solders ,

Journal Effect of Sn addition on the corrosion behavior of Ti-7Cu-Sn cast alloys for biomedical applications,

Journal Effect of 0.5 wt% nano-TiO2 addition into low-Ag Sn0.3Ag0.7Cu solder on the intermetallic growth with Cu substrate during isothermal aging,

2013

Journal The influences of chromium addition and quenching treatment on the mechanical properties and fracture behaviors of diffusion-alloyed powder metal steels,

Journal Direct activesolderingofmicro-arcoxidizedTi/Tijointsinairusing Sn3.5Ag0.5Cu4Ti(RE)filler,

Journal Direct active soldering of micro-arc oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE)filler,

2012

Journal The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu-0.5Al2O3 composite solder/Cu interface during soldering reaction,

Journal The effects of alloying elements and microstructure on the impact toughness of powder metal steels,

Journal Prediction of package warpage combined experimental and simulation for four maps substrate,

Journal Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder,

Journal Growth kinetics of the intermetallic compounds during the interfacial reactions between Sn3.5Ag0.9Cu-nanoTiO2 alloys and Cu substrate,

Journal Flow stress behavior of commercial pure titanium sheet during warm tensile deformation,

Journal Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging,

Journal Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder,

Journal Effect of TiO2 nanoparticles on the microstructure and bonding strengths of Sn0.7Cu composite solder BGA packages with immersion Sn surface finish,

Journal Direct robust active bonding between Al heat sink and Si substrate,

Journal Corrosion characterization of Cu–Sn intermetallics in 3.5 wt.% NaCl solution,

Journal Brazing of 6061 aluminum alloy/Ti–6Al–4V using Al–Si–Cu–Ge filler metals,

Journal Basic Electrochemical Behavior of Ti-7Cu Alloys for Medical Applications,

Journal Age hardening reaction of the Al0.3CrFe1.5MnNi0.5 high entropy alloy,

Journal 新型旋轉攪拌精煉技術對鎂合金熔湯除氣精煉的影響,

Journal Suppressing effect of 1 wt.% nano-TiO2 addition into low Ag content Sn-Ag-Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging,

Journal Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder,

Book Tsao Lung-Chuan*, Corrosion resistance,

2011

Symposium Y.-S. Lo, P.-A. Chen, C.J. Fang, Tsao Lung-Chuan, J.C. Leong*, Numerical Analysis of a Continuous Hot-Dip Galvanized Molten Zinc Pot with Chemical Reactions,

Symposium L. P. Feng, T. H. Cheng, S. Y. Chang, Tsao Lung-Chuan*, Effect of Ti on the corrosion behaviour of Pb-free Sn3.5Ag 0.5CuXTi solder in 3.5wt.% NaCl solution,

Symposium Jian- Hao Zhong, Chia-Yen Lee*, Tsao Lung-Chuan, Design and Fabrication of Electromagnetic Pumps,

Symposium C. H. Chen, Tsao Lung-Chuan*, J. C. Leong, C. J. Fang, W. Y. Kuo, Study on morphology and growth kinetics of galvanizing coating on steel,

Symposium Tsao Lung-Chuan*, T. H. Cheng, L. P. Feng, H. W. Yang, Effect of novel rotating impeller degassing technique on purging and degassing of molten magnesium alloy,

Symposium Tsao Lung-Chuan*, C. H. Chen, F. S. Wang, Effect of TiO2 addition in Sn-Cu Solder Balls on the Microstructure and Shearing Strength of BGA Packages,

Symposium Tsao Lung-Chuan*, Electrochemical behavior of Ti-7Cu Alloys for medical applications,

Journal Suppressing effect of 0.5 wt.% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging,

Journal Study of interfacial reactions between Sn3.5Ag0.5Cu composite alloys and Cu substrate,

Journal Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder,

Journal Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates,

Journal Influence of Nano-TiCh Reinforcements on the Wettability and Interfacial Reactions of Novel Lead-Free Sn3.5AgO.5Zn Composite Solder/Cu Solder Joints,

Journal Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering,

Journal Effect of nano-TiO2 addition on the microstructure and bonding strengths of Sn3.5Ag0.5Cu composite solder BGA packages with immersion Sn surface finish,

Journal Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder,

Journal Effect of Ti Element Addition on the Microstructure and Microhardness of Lead-free Sn3.5Ag0.5Cu Alloy,

Journal Effect of Al203 Addition in Sn-Ag-Cu Solder Balls on the Microstructure and Shearing Strength of BGA Packages with Immersion Sn Surface Finish,

Journal An investigation of microstructure and mechanical properties of novel Sn3.5Ag0.5Cu–XTiO2 composite solders as functions of alloy composition and cooling rate,

2010

Symposium 張世穎*, Tsao Lung-Chuan, 柯懿原, 李俊彥, 以Sn-3Ag-0.5Cu-4Ti軟銲合金接合6061鋁合金與AZ31鎂合金之研究,

Symposium 傅基容, 洪瑞晟, 張世穎*, Tsao Lung-Chuan, 蕭威典, 熱噴塗鋁合金對鈦-鋁爆炸接合複合板之表面改質研究,,

Symposium Tsao Lung-Chuan, 林裕凱, 張世穎*, 劉仕華, 添加鎂合金之軟銲填料應用於氧化鋁陶瓷與不鏽鋼接合研究,

Symposium Tsao Lung-Chuan, Hsu Yi-Cheng*, 胡志得, 林雨利, 陳祈諺, The Fabrication of Fiber Sensor by Side-Polished on the Parameter of Depth and Roughness,

Symposium Tsao Lung-Chuan*, 朱中平, 彭紹凡, Corrosion Behavior of Al0.3CrFeMnNi High-entropy Alloys in 3.5 wt. % NaCl Solution,

Symposium Tsao Lung-Chuan*, The Application of Taiwan Image Decoration Elements to Modern Jewelry Design：Taking the Elements on Taiwan Troides Magellanus Sonani as an Example,

Symposium Tsao Lung-Chuan*, Application of 3Design Software for Jewelry Design－ A Case Study on Taiwan Tung flower Jewelry Necklaces,

Symposium Tsao Lung-Chuan*, , , , Microstructure Properties of Commercial Pure Titanium Alloy Micro-Arc Oxidized Coating,

Symposium Tsao Lung-Chuan*, , , , , Corrosion behavior of thermally sprayed Al coatings on AZ31 magnesium alloy,

Journal Stress-corrosion cracking susceptibility of AZ31 alloy after varied heat-treatment in 3.5 wt.% NaCl solution,

Journal Electrochemical Behavior of a New Sn3.5Ag0.5Cu Composite Solder,

Journal Electrochemical Behavior of a New Sn3.5Ag0.5Cu Composite Solder,

Journal Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder,

Journal Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder,

Journal Effect of Nano-TiO2 Addition on Wettability and Interfacial Reactions of Sn0.7Cu Composite Solder/Cu Solder Joints,

Journal 以Sn-3Ag-0.5Cu-4Ti軟銲合金接合6061鋁合金與AZ31鎂合金之研究,

2009

Symposium Jyh-Daw Sheu, Tsao Lung-Chuan, Shih-Ying Chang*, Chun-Hsien Chiang, 氧化鋁陶瓷封接之無電鍍鎳金屬化製程研究,

Symposium Tsao Lung-Chuan, Shih-Ying Chang*, Zhen-Sheng Yang, Jiunn-Ren Jaw, Yen-Huan Lei, Soldering of Transparent Conductive Ceramic Sputtering Targets to Backing Plates Using a Low Melting Point Bi-Sn-In-Ti Filler Metal,

Symposium Tsao Lung-Chuan, Shih-Ying Chang*, Yi-Yuan Ke, Jun-Yen Lee, 稀土元素之軟銲填料接合鎂合金與鋁合金研究,

Symposium Tsao Lung-Chuan*, W.H.Sun, Flow behavior of Green AZ31 magnesium alloy for automotive body sheet during warn tensile deformation,

Symposium Tsao Lung-Chuan*, W. H. Sun, C. C. Jain, Effect of aging on interfacial IMC growth reactions between SnAgCu alloys doping nano-TiO2 and Cu substrate,

Symposium Tsao Lung-Chuan*, S. Y. Chang, W. H. Sun, S. F. Yen4, Study of Interfacial Reactions between Sn3.5Ag0.5Cu Alloys and Cu Substrate,

Symposium Tsao Lung-Chuan*, L-L. L. Kai, W. H. Sun, Corrosion Behavior of Commercial Pure Titanium Alloys in 5 wt. % HCl Solution,

Symposium Tsao Lung-Chuan*, C. Y. Weng, L. K. Lin-Liu, The Study of Titanium alloy for Stylish Jewelry Using Anodic Coloring Treatment Technique,

Symposium Tsao Lung-Chuan*, C. Y. Weng, J. Y. Shen, Research on the Feasibility of the Marketing Strategy of South Taiwan Cultural Creative Stylish Jewelry,

Symposium Tsao Lung-Chuan*, Water Simulation of Magnesium Alloy Melts Degassing by a Rotating Impeller Degassing,

Symposium Tsao Lung-Chuan*, The Role of Fine-grain － Coarse-grain on Deformation Mechanisms of Green AZ31 Magnesium Alloy,

Symposium Tsao Lung-Chuan*, Microstructure and mechanical properties of AZ31 magnesium alloy during different heat treatment,

Symposium Tsao Lung-Chuan*, Corrosion characterization of Cu 6 Sn 5 intermetallic compounds in 3.5 wt.% NaCl solution,

Symposium Tsao Lung-Chuan*, Corrosion Characterization of Sn37Pb Solders and With Cu Substrate Soldering Reaction in 3.5wt.% NaCl Solution,

Prize 萬潤2009創新創意競賽,

Journal Study of interfacial reactions between Sn3.5Ag0.5Cu alloys and Cu substrate,

Journal Research of incorporating emerging technology into the special course in vocational high school-A case study on precision casting,

Journal Optimal Design Based on Taguchi Method for rotating impeller degassing, Foundry,

Journal Joining 6061 aluminum alloy with Al–Si–Cu filler metals,

Journal Corrosion characterization of Sn37Pb solders and with cu substrate soldering reaction in 3.5wt.% NaCl solution,

Book Tsao Lung-Chuan*, Magnesium,

2008

Symposium Tsao Lung-Chuan*, Application of problem-based learning strategy of incorporating emerging technology into the special course in vocational high school,

Symposium Tsao Lung-Chuan*, 新興科技融入高職專題製作課程研發—以精密鑄造為例,

Journal Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads,

Journal Effects of new materials and new technologies in modern jewelry,

Journal Active soldering of ZnS-SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal,

Journal 新興科技融入高職專題製作課程之研發,

2007

Journal 3Design參數化珠寶設計軟體在珠寶設計之應用與教學之研究,

2006

Journal Active soldering of ITO to copper,

Journal 整合時尚藝術美學與3D數位科技–以珠寶設計與製造為例,

2005

Journal A Study of Microstructure and High Aspect Ratio of Sn-36Pb-2Ag Alloy by Microcasting Technique,

2004

Journal 高中職社區化創意課程–「琉璃藝術」,

2003

Journal Stress-Corrosion Cracking Behavior of AZ31 alloy in 3.5wt. % NaCl Solution,

Journal Morphology and Kinetics of Discontinuous Precipitation and Dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C Alloy,

Journal Intermetallic Compounds Formed During the Reflow of In-49Sn Solder Ball Array Packages,

Journal Anodic Surface Coloring Treatment for a superplastic Zn-22wt.% Al Alloy,

Journal Active Soldering of Indium Tin Oxide (ITO) with Cu in Air using an Sn3.5Ag4Ti(Ce,Ga) Filler,

Journal 透明導電ITO膜濺鍍靶材與其銅背板之低溫活性軟銲接合,

2002

Journal Morphology and Growth Kinetics of Ag3Sn during Soldering Reaction between Liquid Sn and an Ag Substrate,

Journal Intermetallic Compounds Formed during the interfacial Reactions of Liquid Sn and Sn-3.5Ag Solders with Ag Thick Films,

Journal Intermetallic Compounds Formed During the Reflow of In-49Sn Solder Ball Array Packages,

Journal Forming and Bonding Microchannels for the Manufacture of IC Chip Heat Dissipators,

Journal Evaluation of the Formability of Plastic/Zn22Al/Plastic sandwiched Structure by Gas Blowing,

Journal Effects of Zinc addition on the Microstructure and Melting Temperature of Al-Si-Cu Filler Metals,

Journal Corrosion Behavior of Al-Si-Cu-(Sn, Zn) Brazing Filler Metals”,,

Journal Corrosion Behavior of Al-Si-Cu Based Filler Metals and 6061-T6 Brazements,

Journal Brazeability of a 3003 Aluminum Alloy with Al-Si-Cu Based Filler metals,

2001

Journal The Utra-High Rate Superplastic Forming of a Zn-22Al Thin Sheet Material,

Journal Surface Self-Cleaning Effect of Zn-22Al Alloy during Superplastic Deformation,

Journal Evaluation of Superplastic Formability of the AZ31 Magnesium Alloy,

Journal Brazeability of the 6061-T6 Aluminum Alloy with Al-Si-20Cu-Based Filler Metals,

Journal AgIn2 /Ag2In Transformations in an In-49Sn/Ag Soldered Joint under Thermal Aging,

Book Tsao Lung-Chuan*, 精密鑄造種類與應用”，精密鑄造職類能力本位訓練教材,

Book Tsao Lung-Chuan*, 精密鑄造的特性 ”，精密鑄造職類能力本位訓練教材,

Book Tsao Lung-Chuan*, 檢查與整型蠟型 ”，精密鑄造職類能力本位訓練教材,

Book Tsao Lung-Chuan*, “精密鑄造與生活”，精密鑄造職類能力本位訓練教材,

2000

Journal Evaluation of Low Temperature Superplastic Formability for Zn-22Al Thin Sheets,

Journal Effects of Microstructures on Corrosion and Stress Corrosion Behavior of an Al-12.1at% Zn allo,

Journal Development of a Low-Melting-Point Filler Metal for Brazing Aluminum Alloys,

1998

Journal The degassing equipment for molten aluminum,