2024

• Journal   曹龍泉*, Joining of SiO2 glass and substrate using In49Sn active solder in air, J Mater Sci: Mater Electron , 0, 35, 81-81

2023

• Symposium   曹龍泉*, Effects of Heat Treatment on Microstructure evolution and Mechanical Properties of As-extruded LAZ1010 Alloys, International Conference on Applied Engineering, Materials and Mechanics (8th ICAEMM 2023), 首爾, 大韓民國(南韓)
• Journal   曹龍泉*, Improved Mechanical and Corrosion Properties of Powder Metallurgy Austenitic, Ferritic, and Martensitic Stainless Steels by Liquid Phase Sintering, Materials, 0, 15, 5483-5483

2022

• Symposium   曹龍泉*, 添加石墨稀對鋅-空氣燃料電池之放電效率的影響, 111年度防蝕工程年會暨論文發表會, 高雄, 中華民國
• Prize   2022 華立材料大賽, 中國材料科學學會, 中華民國
• Prize   全球前 2% 頂尖科學家榜單（World’s Top 2% Scientists 2020）-2020年科學影響力頂尖科學家, Scopus , 美國
• Prize   全球前 2% 頂尖科學家榜單（World’s Top 2% Scientists 2020）「終身科學影響力排行榜（1960 – 2020）頂尖科學家, Scopus, 美國

2021

• Journal   曹龍泉*, Fluxless Direct Soldering of Transparent Conductive Oxides (TCOs) to Copper, Advances in Materials Science and Engineering, 0, 0, 1-7
• Journal   曹龍泉*, Effects of Adding Active Elements to Aluminum-Based Filler Alloys on the Bonding of 6061 Aluminum Alloy and Alumina, Appl. Sci., 0, 11, 1-16

2020

• Symposium   曹龍泉*, Effects of different electrolyte systems on microstructure, corrosion behavior and antibacterial properties of micro-arc oxidation ceramic coatings of commercially pure titanium, 2020 4th European Conference on Materials, Mechatronics and Manufacturing, Greece, 希臘共和國, 1-6
• Symposium   曹龍泉*, A Study on the Properties of Antibacterial Cu-Bearing 316 Stainless Steel, 109年度防蝕工程年會暨論文發表會, 雲林, 中華民國
• Journal   曹龍泉*, Effects of Different Electrolytes on Microstructure and Antibacterial Properties of Microarc Oxidized Coatings of CP-Ti, International Journal of Materials, Mechanics and Manufacturing, 8, 2, 34-39
• Journal   曹龍泉*, Effect of Heat Treatment Conditions on the Mechanical Properties and Machinability of Ti15SnxCu Alloys, Materials Research, 23, 3, 1-9

2019

• Symposium   曹龍泉*, Study on the 7075Al-based fiber metal laminates prepared by ultrasonic-aided active bonding, 科技部工程司108年度機械固力、熱流、能源學門聯合成果發表會 , 台北, 中華民國
• Symposium   曹龍泉*, Jewelry material–present and future, ISIC 2019 – International Seminar on Investment Casting, Taichung, 中華民國
• Book   曹龍泉*, Fillers – Synthesis, Characterization and Industrial Application, IntechOpen, Active Solders and Active Soldering, ISBN: 10.5772/intechopen.82382

2018

• Symposium   曹龍泉*, Electrochemical behavior of Ti-Cu-Sn alloys in the 0.2 wt.%NaF mouthwashes, 29th Annual Meeting of the European Society for Biomaterials, 9/9–13, Maastricht, 荷蘭王國, 1-4
• Symposium   曹龍泉*, A study of direct writing the low-melting-point In-based active alloy ink to directly make a solidified circuit, 科技部工程司機械固力、熱流與能源學門聯合成果發表會, 嘉義, 中華民國, 1-1
• Symposium   楊州斌, 曹龍泉*, , , , , –, 107年度防蝕工程年會暨論文發表會, 台東, 中華民國, 1-1
• Symposium   The study of toner on the moisturizing skin by use differences between skin activating apparatus makeup and traditional makeup, 2018 International Conference on Interdisciplinary Design and Industrial-Academic Collaboration,, Kaohsiung, 中華民國, 1-8
• Symposium   , , , 曹龍泉*, –, 107年度防蝕工程年會暨論文發表會(2018), 台東, 中華民國, 1-1
• Prize   107年學年度研究生研究成果獎勵獎, 屏東科技大學, 中華民國
• Journal   C. L. Chuang, 曹龍泉*, Effects of nanoparticles on the thermal, microstructural and mechanical properties of novel Sn3.5Ag0.5Zn composite solders, Journal of Materials Science: Materials in Electronics, SPRINGER, 29, 4096-4105
• Journal   曹龍泉*, S. Y. CHANG, Y. C. YU, Direct active soldering of Al0.3CrFe1.5MnNi0.5 high entropy alloy to 6061-Al using Sn−Ag−Ti active solder, Trans. Nonferrous Met. Soc. China, Elsevier, 28, 748-756
• Journal   曹龍泉*, Ming-Jer Hsieh, Yung-Ching Yu, Effects of Sn additions on microstructure and corrosion resistance of heat-treated Ti–Cu–Sn titanium alloys, Corrosion Engineering, Science and Technology , TAYLOR & FRANCIS, 53, 252-258
• Journal   曹龍泉*, Effects of applied voltage on the microstructure and properties of hydroxyapatite bioceramic coatings formed on Ti7Cu5Sn titanium alloy by micro-arc oxidation, Corrosion Engineering, Science and Technology , TAYLOR & FRANCIS, 53, 528-590

2017

• Symposium   曹龍泉*, –, 106年度工程技術發展處「技術及知識應用型產學合作計畫成果發表暨績效考評會議, 台南, 中華民國, 1-1
• Symposium   Preparation and characterization of biomimetically and electrochemically deposited hydroxyapatite coatings on micro-arc oxidized Ti-7Cu-5Sn, 2016台灣鍍膜科技協會年會(TACT 2016)暨科技部專題計畫研究成果發表會論文集, 屏東, 中華民國
• Symposium   Effects of different electrolyte systems on microstructure, corrosion behavior and antibacterial properties of micro-arc oxidation ceramic coatings of commercially pure titanium, 2016台灣鍍膜科技協會年會(TACT 2016)暨科技部專題計畫研究成果發表會論文集, 屏東, 中華民國
• Symposium   Effect of tio2 nanoparticles on the corrosion property of novel Sn3.5Ag0.5Bi solders, 4th world congress and expo on nanotechnology & Materials Science, Barcelona, 西班牙王國
• Symposium   Effect of Microstructure on the Performance of a LA92 Alloy Anode for Mg-Air Battery Application, International Conference on Advances in Functional Materials, LA, 美國
• Journal   Influences of argon plasma cleaning on the die-shear force of chip and copper/polyimide flexible substrate assembly using a non-conductive film, Journal of the Chinese Institute of Engineers, ----, 33
• Journal   Influence of Cu addition on the structures and properties of Ti15SnxCu alloys, Materials science and technology, ----, 33
• Journal   Effects of Cu addition on the microstructure and mechanical properties of Ti15Sn alloys, Materials Science & Engineering A, ----, 698

2016

• Symposium   Preparation and characterization of biomimetically and electrochemically deposited hydroxyapatite coatings on micro-arc oxidized Ti-7Cu-5Sn, 2016台灣鍍膜科技協會年會(TACT 2016)暨科技部專題計畫研究成果發表會, 屏東, 中華民國
• Symposium   Effects of different electrolyte systems on microstructure, corrosion behavior and antibacterial properties of micro-arc oxidation ceramic coatings of commercially pure titanium, 2016台灣鍍膜科技協會年會(TACT 2016)暨科技部專題計畫研究成果發表會, 屏東, 中華民國
• Symposium   鎂合金作為鎂燃料電池陽極材料的性能研究, 2016第十一屆全國氫能與燃料電池學術研討會暨第三屆台灣能源學會年會, 台北, 中華民國
• Symposium   以Ｓn-Ag-Cu-Ti活性銲料直接活性接合6061 Al/MAO-6061Al, 2016年台灣陶瓷學會年會暨科技部專題研究計畫成果發表會, 屏東, 中華民國
• Journal   Selective electrode patterning of ITO films using pulsed, Opt Quant Electron, ----, 48
• Journal   Active soldering of aluminum–graphite composite to aluminum using Sn3.5Ag4Ti0.5Cu active filler, Int. J. Mater. Res., ----, 107
• Journal   “Effect ofnano-TiO2 particles andcoolingrateonthethermal,, MaterialsScience&EngineeringA, ----, 658

2015

• Symposium   抗菌技術應用於現代化家禽養殖場設備之研發, 科技部工程司104年度機械固力、熱流、能源學門聯合成果發表會, 高雄, 中華民國
• Symposium   抗菌技術應用於現代化家禽養殖場設備之研發, 104年度工程技術發展處「技術及知識應用型產學合作計畫成果發表暨績效考評會議, 台中, 中華民國
• Symposium   低溫複合銅導電膏應用於矽基太陽能電池之研究, 材料年會, 高雄, 中華民國
• Prize   2015年台北國際發明暨技術交易展 金牌, 經濟部國際貿易局, 中華民國
• Prize   2015年台北國際發明暨技術交易展 金牌, 經濟部國際貿易局, 中華民國
• Prize   104年度教師研發成果競賽優良?, 國立屏東科技大學, 中華民國
• Prize   104年度教師研發成果競賽優良?, 國立屏東科技大學, 中華民國
• Prize   104年度技術及知識應用型產學合作計畫成果發表暨績效考評會-海報展示優良獎, 科技部, 中華民國
• Prize   104年度技術及知識應用型產學合作計畫成果發表暨績效考評會-海報展示優良獎, 科技部, 中華民國
• Prize   103年學年度研究生研究成果獎勵獎, 屏東科技大學, 中華民國
• Prize   103年學年度研究生研究成果獎勵獎, 屏東科技大學, 中華民國
• Journal   Plastic flow behavior, microstructure, and corrosion behavior of AZ61 Mg alloy during hot compression deformation , Journal of Manufacturing Processes, ----, 18
• Journal   Effect of TiO2 nanoparticle addition and cooling rate on microstructure and mechanical properties of novel Sn1.5Sb0.7Cu solders , Journal of Materials Science - Materials in Electronics, ----, 26
• Journal   Effect of Sn addition on the corrosion behavior of Ti-7Cu-Sn cast alloys for biomedical applications, Materials Science and Engineering C, ----, 46
• Journal   Effect of 0.5 wt% nano-TiO2 addition into low-Ag Sn0.3Ag0.7Cu solder on the intermetallic growth with Cu substrate during isothermal aging, Journal of Materials Science - Materials in Electronics, ----, 26

2013

• Journal   Ming-Wei Wu, 曹龍泉, Shih-YingChang*, The influences of chromium addition and quenching treatment on the mechanical properties and fracture behaviors of diffusion-alloyed powder metal steels, Materials Science and Engineering: A, elsevier, 565, 196-202
• Journal   曹龍泉*, Direct activesolderingofmicro-arcoxidizedTi/Tijointsinairusing Sn3.5Ag0.5Cu4Ti(RE)filler, MaterialsScience&EngineeringA, MaterialsScience&Eng, 63-71
• Journal   曹龍泉*, Direct active soldering of micro-arc oxidized Ti/Ti joints in air using Sn3.5Ag0.5Cu4Ti(RE)filler, Materials Science & Engineering A, Elsevier, 565, 63-71

2012

• Journal   T.H. Chuang, 曹龍泉*, Chien-Han Chung, S.Y. Chang, Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging, Materials & Desig, 39, 475-483
• Journal   S.Y. Chang*, 曹龍泉, S.M. Mao, C.H. Huang, Brazing of 6061 aluminum alloy/Ti–6Al–4V using Al–Si–Cu–Ge filler metals, Journal of Materials Processing Technology, Elsevier, 212, 8-14
• Journal   S. Y. Chang, 曹龍泉*, M. W. Wu, C. W. Chen, The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu-0.5Al2O3 composite solder/Cu interface during soldering reaction, J Mater Sci: Mater Electron, Springer, 23, 100-107
• Journal   M.W. Wu*, 曹龍泉, G.J. Shu, B.H. Lin, The effects of alloying elements and microstructure on the impact toughness of powder metal steels, Materials Science and Engineering A, 538, 135-144
• Journal   C.L. Chuang, 曹龍泉*, H.K. Lin, L.P. Feng, Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder, Materials Science & Engineering A, 558, 478-484
• Journal   曹龍泉*, 鄭德賢, 馮立平, 新型旋轉攪拌精煉技術對鎂合金熔湯除氣精煉的影響, 鑄造工程學刊, 台灣鑄造學會, 152, 32-38
• Journal   曹龍泉*, W.T.Huang, M. W. Wu, Sheng-Lung, Su, Suppressing effect of 1 wt.% nano-TiO2 addition into low Ag content Sn-Ag-Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE, 2012, 465-468
• Journal   曹龍泉*, T. T. Lo, S. F. Peng, Growth kinetics of the intermetallic compounds during the interfacial reactions between Sn3.5Ag0.9Cu-nanoTiO2 alloys and Cu substrate, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, IEEE, 190-194
• Journal   曹龍泉*, S. Y. Chang, Meng-Syuan, Huang, C. S. Chen, Direct robust active bonding between Al heat sink and Si substrate, 2012 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), IEEE, 2012, 1635-1638
• Journal   曹龍泉*, M. W. Wu, S. Y. Chang, Effect of TiO2 nanoparticles on the microstructure and bonding strengths of Sn0.7Cu composite solder BGA packages with immersion Sn surface finish, J Mater Sci: Mater Electron, Springer, 23, 681-687
• Journal   曹龍泉*, H.Y. Wu, J.C. Leong, C.J. Fang, Flow stress behavior of commercial pure titanium sheet during warm tensile deformation, Materials & Design, Elsevier, 34, 179-184
• Journal   曹龍泉*, C.S. Chen, C.P. Chu, Age hardening reaction of the Al0.3CrFe1.5MnNi0.5 high entropy alloy, Materials & Design, 36, 854-858
• Journal   曹龍泉*, C.H. Huang, R.S. Chen, Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder, Materials Science and Engineering A, Elsevier, 545, 194-200
• Journal   曹龍泉*, Prediction of package warpage combined experimental and simulation for four maps substrate, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, IEEE, 576-581
• Journal   曹龍泉*, Corrosion characterization of Cu–Sn intermetallics in 3.5 wt.% NaCl solution, Corrosion Science, 63, 393-398
• Journal   曹龍泉*, Basic Electrochemical Behavior of Ti-7Cu Alloys for Medical Applications, Acta physica polonica A, 122, 561-564
• Journal   曹龍泉*, Effects of small amount of active Ti element additions on microstructure and property of Sn3.5Ag0.5Cu solder, Materials Science and Engineering A , 558, 478-484
• Book   曹龍泉*, Corrosion resistance, Intech, 1, ISBN: 979-953-307-264-6

2011

• Symposium   Y.-S. Lo, P.-A. Chen, C.J. Fang, 曹龍泉, J.C. Leong*, Numerical Analysis of a Continuous Hot-Dip Galvanized Molten Zinc Pot with Chemical Reactions, 中國機械工程學會第二十八屆全國學術研討會, 台中, 中華民國, 1-6
• Symposium   L. P. Feng, T. H. Cheng, S. Y. Chang, 曹龍泉*, Effect of Ti on the corrosion behaviour of Pb-free Sn3.5Ag 0.5CuXTi solder in 3.5wt.% NaCl solution, 中華民國防蝕工程學會 100 年度防蝕工程年會暨論文發表會, 台北, 中華民國, 1-6
• Symposium   Jian- Hao Zhong, Chia-Yen Lee*, 曹龍泉, Design and Fabrication of Electromagnetic Pumps, 2011 兩岸綠色暨防災科技學術研討會 屏東科技大學/北京科技大學第六屆學術交流研討會, 屏東, 中華民國, 1-5
• Symposium   C. H. Chen, 曹龍泉*, J. C. Leong, C. J. Fang, W. Y. Kuo, Study on morphology and growth kinetics of galvanizing coating on steel, 2011 兩岸綠色暨防災科技學術研討會, 屏東, 中華民國, 1-5
• Symposium   曹龍泉*, T. H. Cheng, L. P. Feng, H. W. Yang, Effect of novel rotating impeller degassing technique on purging and degassing of molten magnesium alloy, 台灣鑄造學會100年度論文發表會, 高雄, 中華民國, 1-7
• Symposium   曹龍泉*, C. H. Chen, F. S. Wang, Effect of TiO2 addition in Sn-Cu Solder Balls on the Microstructure and Shearing Strength of BGA Packages, 2011 兩岸綠色暨防災科技學術研討會, 屏東, 中華民國, 1-4
• Symposium   曹龍泉*, Electrochemical behavior of Ti-7Cu Alloys for medical applications, 12 th International symposium on Physica of Materials (ISPMA12), 布拉格, 中華民國, 1-9
• Journal   朱中平, 曹龍泉*, Effect of Ti Element Addition on the Microstructure and Microhardness of Lead-free Sn3.5Ag0.5Cu Alloy, 鑄造工程學刊, 台灣鑄造學會, 29-34
• Journal   T. H. Chuang, M.W.Wu, S. Y. Chang, S. F. Ping, 曹龍泉*, Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder, J Mater Sci: Mater Electron, springer, 22, 1021-1027
• Journal   T. H. Cheng, 曹龍泉*, F. S. Wang, W. Y. Kuo, Effect of Al203 Addition in Sn-Ag-Cu Solder Balls on the Microstructure and Shearing Strength of BGA Packages with Immersion Sn Surface Finish, 2011 International Conference on Electronic Packaging Technology & High Density Packaging, 374-378
• Journal   S.Y. Chang, C.C. Jain, T.H. Chuang, L.P. Feng, 曹龍泉*, Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder, Materials and Design, Elsevier, 32, 4720-4727
• Journal   R. W. Wu, 曹龍泉*, S. Y. Chang, C. C. Jain, R. S. Chen, Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates, Journal of Materials Science: Materials in Electronics, Springer, 22, 1181-1187
• Journal   L. P. Feng, S. Y. Chang, 曹龍泉*, F. S. Wang, Influence of Nano-TiCh Reinforcements on the Wettability and Interfacial Reactions of Novel Lead-Free Sn3.5AgO.5Zn Composite Solder/Cu Solder Joints, 2011 International Conference on Electronic Packaging Technology & High Density Packaging, 260-263
• Journal   曹龍泉*, C.P. Chu,, S.F. Peng, Study of interfacial reactions between Sn3.5Ag0.5Cu composite alloys and Cu substrate, Microelectronic Engineering, Elsevier, 88, 2964-2969
• Journal   曹龍泉*, Suppressing effect of 0.5 wt.% nano-TiO2 addition into Sn–3.5Ag–0.5Cu solder alloy on the intermetallic growth with Cu substrate during isothermal aging, Journal of Alloys and Compounds, Elsevier, 509, 8441-8448
• Journal   曹龍泉*, Evolution of nano-Ag3Sn particle formation on Cu–Sn intermetallic compounds of Sn3.5Ag0.5Cu composite solder/Cu during soldering, Journal of Alloys and Compounds, Elsevier, 509, 2326-2333
• Journal   曹龍泉*, An investigation of microstructure and mechanical properties of novel Sn3.5Ag0.5Cu–XTiO2 composite solders as functions of alloy composition and cooling rate, Materials Science and Engineering A, 529, 41-48
• Journal   梁茲程, 曹龍泉*, C. J. Fang, C. P. Chu, Effect of nano-TiO2 addition on the microstructure and bonding strengths of Sn3.5Ag0.5Cu composite solder BGA packages with immersion Sn surface finish, J Mater Sci: Mater Electron, Springer, 22, 1443-1449

2010

• Symposium   張世穎*, 曹龍泉, 柯懿原, 李俊彥, 以Sn-3Ag-0.5Cu-4Ti軟銲合金接合6061鋁合金與AZ31鎂合金之研究, 台灣鎂合金協會99年度會員大會暨論文發表會, 高雄., 中華民國
• Symposium   傅基容, 洪瑞晟, 張世穎*, 曹龍泉, 蕭威典, 熱噴塗鋁合金對鈦-鋁爆炸接合複合板之表面改質研究,, 中國機械工程學會第二十七屆全國學術研討會, 台北市, 北科大. , 中華民國
• Symposium   曹龍泉, 林裕凱, 張世穎*, 劉仕華, 添加鎂合金之軟銲填料應用於氧化鋁陶瓷與不鏽鋼接合研究, 2010中國材料科學學會年會, 高雄, 義守大學., 中華民國
• Symposium   曹龍泉, 許益誠*, 胡志得, 林雨利, 陳祈諺, The Fabrication of Fiber Sensor by Side-Polished on the Parameter of Depth and Roughness, 2010 北京科技大學暨屏東科技大學第五屆學術交流研討會, 中華民國
• Symposium   曹龍泉*, 朱中平, 彭紹凡, Corrosion Behavior of Al0.3CrFeMnNi High-entropy Alloys in 3.5 wt. % NaCl Solution, 2010 北京科技大學暨屏東科技大學第五屆學術交流研討會, 中華民國
• Symposium   曹龍泉*, The Application of Taiwan Image Decoration Elements to Modern Jewelry Design：Taking the Elements on Taiwan Troides Magellanus Sonani as an Example, 2010 北京科技大學暨屏東科技大學第五屆學術交流研討會, 中華民國
• Symposium   曹龍泉*, Application of 3Design Software for Jewelry Design－ A Case Study on Taiwan Tung flower Jewelry Necklaces, 2010 現代設計國際學術研討會 論文集, 中華民國
• Symposium   曹龍泉*, , , , Microstructure Properties of Commercial Pure Titanium Alloy Micro-Arc Oxidized Coating, 2010 北京科技大學暨屏東科技大學第五屆學術交流研討會, 北京, 中華民國
• Symposium   曹龍泉*, , , , , Corrosion behavior of thermally sprayed Al coatings on AZ31 magnesium alloy, 中華民國防蝕工程學會 99 年度防蝕工程年會暨論文發表會, 中華民國, 1-5
• Journal   曹龍泉, 張世穎*, 雷衍桓, 柯懿原, 李俊彥, 以Sn-3Ag-0.5Cu-4Ti軟銲合金接合6061鋁合金與AZ31鎂合金之研究, 鎂合金產業通訊 , 鎂合金產業通訊 , 51, 51-56
• Journal   曹龍泉*, T. T. Lo, S. F. Peng, S. Y. Chang, Electrochemical Behavior of a New Sn3.5Ag0.5Cu Composite Solder, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, IEEE, 1013-1017
• Journal   曹龍泉*, T. T. Lo, S. F. Peng, S. Y. Chang, Electrochemical Behavior of a New Sn3.5Ag0.5Cu Composite Solder, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, 1013-1017
• Journal   曹龍泉*, S.Y. Chang, C.I. Lee, W.H. Sun, C.H. Huang, Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder, Materials and Design , Elsevier, 31, 4831-4835
• Journal   曹龍泉*, S.Y. Chang, Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder, Materials and Design, 31, 990-993
• Journal   曹龍泉*, B. C. Wang, C. W. Chang, M. W. Wu, Effect of Nano-TiO2 Addition on Wettability and Interfacial Reactions of Sn0.7Cu Composite Solder/Cu Solder Joints, 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging, IEEE, 250-253
• Journal   曹龍泉*, Stress-corrosion cracking susceptibility of AZ31 alloy after varied heat-treatment in 3.5 wt.% NaCl solution, International Journal of Materials Research, International Journal of Materials Research, 101, 1166-1171

2009

• Symposium   Jyh-Daw Sheu, 曹龍泉, Shih-Ying Chang*, Chun-Hsien Chiang, 氧化鋁陶瓷封接之無電鍍鎳金屬化製程研究, 台灣真空學會年會2009年論文研討會, 中華民國
• Symposium   曹龍泉, Shih-Ying Chang*, Zhen-Sheng Yang, Jiunn-Ren Jaw, Yen-Huan Lei, Soldering of Transparent Conductive Ceramic Sputtering Targets to Backing Plates Using a Low Melting Point Bi-Sn-In-Ti Filler Metal, 台灣真空學會年會2009年論文研討會, 中華民國
• Symposium   曹龍泉, Shih-Ying Chang*, Yi-Yuan Ke, Jun-Yen Lee, 稀土元素之軟銲填料接合鎂合金與鋁合金研究, 2009台灣金屬熱處理學會2009年論文研討會, 中華民國
• Symposium   曹龍泉*, W.H.Sun, Flow behavior of Green AZ31 magnesium alloy for automotive body sheet during warn tensile deformation, 2009海峽兩岸現代工程科技應用研討會Across the Taiwan Straits Conference on Application of modern engineering Technologiess (ATSCAMET2009), 嘉義, 中華民國, 65-68
• Symposium   曹龍泉*, W. H. Sun, C. C. Jain, Effect of aging on interfacial IMC growth reactions between SnAgCu alloys doping nano-TiO2 and Cu substrate, 2009『屏東科技大學』暨『北京科技大學』第四屆學術交流研討會, 屏東, 中華民國, 136-139
• Symposium   曹龍泉*, S. Y. Chang, W. H. Sun, S. F. Yen4, Study of Interfacial Reactions between Sn3.5Ag0.5Cu Alloys and Cu Substrate, 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 北京, 中華民國, 886-889
• Symposium   曹龍泉*, L-L. L. Kai, W. H. Sun, Corrosion Behavior of Commercial Pure Titanium Alloys in 5 wt. % HCl Solution, 2009『屏東科技大學』暨『北京科技大學』第四屆學術交流研討會, 屏東, 中華民國, 140-143
• Symposium   曹龍泉*, C. Y. Weng, L. K. Lin-Liu, The Study of Titanium alloy for Stylish Jewelry Using Anodic Coloring Treatment Technique, 2009『屏東科技大學』暨『北京科技大學』第四屆學術交流研討會, 屏東, 中華民國, 142-146
• Symposium   曹龍泉*, C. Y. Weng, J. Y. Shen, Research on the Feasibility of the Marketing Strategy of South Taiwan Cultural Creative Stylish Jewelry, 2009『屏東科技大學』暨『北京科技大學』第四屆學術交流研討會, 屏東, 中華民國, 136-141
• Symposium   曹龍泉*, Water Simulation of Magnesium Alloy Melts Degassing by a Rotating Impeller Degassing, 2009『屏東科技大學』暨『北京科技大學』第四屆學術交流研討會, 屏東, 中華民國, 144-148
• Symposium   曹龍泉*, The Role of Fine-grain － Coarse-grain on Deformation Mechanisms of Green AZ31 Magnesium Alloy, 2009海峽兩岸現代工程科技應用研討會Across the Taiwan Straits Conference on Application of modern engineering Technologiess (ATSCAMET2009), 嘉義, 中華民國, 204-207
• Symposium   曹龍泉*, Microstructure and mechanical properties of AZ31 magnesium alloy during different heat treatment, 8th international conference on magnesium alloys and their applications, 威碼, 中華民國, 818-823
• Symposium   曹龍泉*, Corrosion characterization of Cu 6 Sn 5 intermetallic compounds in 3.5 wt.% NaCl solution, 2009『屏東科技大學』暨『北京科技大學』第四屆學術交流研討會, 屏東, 中華民國, 133-135
• Symposium   曹龍泉*, Corrosion Characterization of Sn37Pb Solders and With Cu Substrate Soldering Reaction in 3.5wt.% NaCl Solution, 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), 北京, 中華民國, 1164-1166
• Prize   萬潤2009創新創意競賽, 崑山科技大學, 中華民國
• Journal   S.Y. Chang, 曹龍泉, T.Y. Li, T.H. Chuang*, Joining 6061 aluminum alloy with Al–Si–Cu filler metals, Journal of Alloys and Compounds, 488, 1, 174-180
• Journal   曹龍泉*, OU Bin-lung, Optimal Design Based on Taguchi Method for rotating impeller degassing, Foundry, Foundry, 58, 1216-1219
• Journal   曹龍泉*, Chang, S.Y., , , Study of interfacial reactions between Sn3.5Ag0.5Cu alloys and Cu substrate, 2009 International Conference on Electronic Packaging Technology and High Density Packaging,, 886-889
• Journal   曹龍泉*, Research of incorporating emerging technology into the special course in vocational high school-A case study on precision casting, casting technology, 242, 20-27
• Journal   曹龍泉*, Corrosion characterization of Sn37Pb solders and with cu substrate soldering reaction in 3.5wt.% NaCl solution, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HD, 1164-1166
• Book   曹龍泉*, Magnesium, DGM, 1, ISBN: 978-3-527-32732-4

2008

• Symposium   曹龍泉*, Application of problem-based learning strategy of incorporating emerging technology into the special course in vocational high school, 2008科技教育課程改革與發展學術研討會2008 International Conference: Curriculum & Instruction in Technology Education , 高雄, 中華民國
• Symposium   曹龍泉*, 新興科技融入高職專題製作課程研發—以精密鑄造為例, 台灣鑄造學會論文發表會, 台南, 中華民國, 1-11
• Journal   S.Y.Chang*, T.H.Chuang, 曹龍泉, C.L.Yang, Z.S.Yang, Active soldering of ZnS-SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal, J Mater. Process Technol.,, 202, 1-3, 22-26
• Journal   C.C. Chi, 曹龍泉, C.W. Tsao, T.H. Chuang*, Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads, Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads, 17, 1, 134-140
• Journal   曹龍泉*, 鄧惠源, 陳東慶, 林益昌, 新興科技融入高職專題製作課程之研發, 南港高工學報, 26, 1-24
• Journal   曹龍泉*, Effects of new materials and new technologies in modern jewelry, J. Tai. Found. Soc.,, 34, 6, 26-31

2007

• Journal   曹龍泉*, 3Design參數化珠寶設計軟體在珠寶設計之應用與教學之研究, 南港高工學報, 25, 15-24

2006

• Journal   S. Y. Chang, M. H. Lu, 曹龍泉*, T. H. Chuang, Active soldering of ITO to copper, Welding J., 85, 4, 81-83
• Journal   曹龍泉*, 整合時尚藝術美學與3D數位科技–以珠寶設計與製造為例, 南港高工學報, 24, 361-371

2005

• Journal   曹龍泉*, A Study of Microstructure and High Aspect Ratio of Sn-36Pb-2Ag Alloy by Microcasting Technique, J. Tai. Found. Soc., 31, 2, 16-22

2004

• Journal   曹龍泉*, 高中職社區化創意課程–「琉璃藝術」, 南港高工學報, 22, 49-67

2003

• Journal   T. H. Chuang,*, 曹龍泉, H. M. Wu, Intermetallic Compounds Formed During the Reflow of In-49Sn Solder Ball Array Packages, Journal of Electronic Materials, 3, 3, 195-200
• Journal   T. H. Chuang, 曹龍泉*, J. R. Cheng, Anodic Surface Coloring Treatment for a superplastic Zn-22wt.% Al Alloy, J. Chin. Corr. Eng, 17, 2, 145-151
• Journal   S. Y. Chang, 曹龍泉, C. N. Tung, G. H. Pan, T. H. Chuang*, Active Soldering of Indium Tin Oxide (ITO) with Cu in Air using an Sn3.5Ag4Ti(Ce,Ga) Filler, J. Mater. Eng. Perf., 12, 4, 383-389
• Journal   S. S. Wang, 曹龍泉, T. H. Chuang*, Morphology and Kinetics of Discontinuous Precipitation and Dissolution in an Fe-8.5Al-27Mn-1.0Si-0.92C Alloy, Metall. and Meter. Trans. A, 34, 1, 25-31
• Journal   曹龍泉*, T. H. Chuang, Stress-Corrosion Cracking Behavior of AZ31 alloy in 3.5wt. % NaCl Solution, J. Chin. Corr. Eng., 17, 4, 391-396
• Journal   曹龍泉*, , , , , 透明導電ITO膜濺鍍靶材與其銅背板之低溫活性軟銲接合, welding and Cutting, 1, 15-18

2002

• Journal   T. L. Su, S. S. Wang, 曹龍泉*, S. Y. Chang, T. H. Chuang, Corrosion Behavior of Al-Si-Cu Based Filler Metals and 6061-T6 Brazements, J. Mater. Eng. Perf, 11, 2, 187-193
• Journal   T. H. Chuang*, P. H. Chen, Y. H. Tseng, 曹龍泉, S. S. Wang, S. Y. Chang, Forming and Bonding Microchannels for the Manufacture of IC Chip Heat Dissipators, J. Mater. Sci. Eng, 34, 2, 73-78
• Journal   T. H. Chuang*, 曹龍泉, H. M. Wu, Intermetallic Compounds Formed During the Reflow of In-49Sn Solder Ball Array Packages, Journal of Electronic Materials., 32, 3, 185-200
• Journal   S. S. Wang, M. D. Cheng, 曹龍泉, T. H. Chuang*, Corrosion Behavior of Al-Si-Cu-(Sn, Zn) Brazing Filler Metals”,, Mater. Character., 47, 401-409
• Journal   曹龍泉, W. P. Weng, M. D. Cheng, C. W. Tsao, T. H. Chuang*, Brazeability of a 3003 Aluminum Alloy with Al-Si-Cu Based Filler metals, J. Mater. Eng. Perf, 11, 4, 360-364
• Journal   曹龍泉, T. L. Su, T. H. Chuang*, Evaluation of the Formability of Plastic/Zn22Al/Plastic sandwiched Structure by Gas Blowing, Polymer Composites, 23, 6, 1036-1043
• Journal   曹龍泉, T. L. Su, S. Y. Chang, T. H. Chuang*, Morphology and Growth Kinetics of Ag3Sn during Soldering Reaction between Liquid Sn and an Ag Substrate, J. Mater. Eng. Perf., 11, 4
• Journal   曹龍泉, T. L. Su, S. Y. Chang, T. H. Chuang*, Intermetallic Compounds Formed during the interfacial Reactions of Liquid Sn and Sn-3.5Ag Solders with Ag Thick Films, J. Mater. Eng. Perf., 11, 5, 481-486
• Journal   曹龍泉, S. S. Wang, M. D. Cheng, T. H. Chung*, Effects of Zinc addition on the Microstructure and Melting Temperature of Al-Si-Cu Filler Metals, Mater. Character., 48, 341-346

2001

• Journal   T. H. Chuang*, Y. T. Huang, 曹龍泉, AgIn2 /Ag2In Transformations in an In-49Sn/Ag Soldered Joint under Thermal Aging, Journal of Electronic Materials, 30, 8, 945-950
• Journal   曹龍泉, T. H. Chuang*, Surface Self-Cleaning Effect of Zn-22Al Alloy during Superplastic Deformation, Z. Metallkunde, 92, 370-375
• Journal   曹龍泉, S. S. Wang, C. F. Yang, T. H. Chuang*, The Utra-High Rate Superplastic Forming of a Zn-22Al Thin Sheet Material, Z. Metallkunde, 92, 1227-1230
• Journal   曹龍泉, C. F. Wu, T. H. Chuang*, Evaluation of Superplastic Formability of the AZ31 Magnesium Alloy, Z. Metallkunde, 91, 572-577
• Journal   曹龍泉*, T. C. Tsai, C. S. Wu, T. H. Chuang, Brazeability of the 6061-T6 Aluminum Alloy with Al-Si-20Cu-Based Filler Metals, J. Mater. Eng. Perf, 10, 6, 705-709
• Book   曹龍泉*, 精密鑄造種類與應用”， 精密鑄造職類能力本位訓練教材, 行政院勞工委員會職業訓練局, 0, ISBN: .
• Book   曹龍泉*, 精密鑄造的特性 ”， 精密鑄造職類能力本位訓練教材, 行政院勞工委員會職業訓練局, 0, ISBN: .
• Book   曹龍泉*, 檢查與整型蠟型 ”， 精密鑄造職類能力本位訓練教材, 行政院勞工委員會職業訓練局, 0, ISBN: .
• Book   曹龍泉*, “精密鑄造與生活”， 精密鑄造職類能力本位訓練教材, 行政院勞工委員會職業訓練局, 0, ISBN: .

2000

• Journal   T. H. Chuang, M. S. Yeh, 曹龍泉*, T. C. Tsai, C. S. Wu, Development of a Low-Melting-Point Filler Metal for Brazing Aluminum Alloys, Metall. and Meter. Trans. A, 31A, 2239-2245
• Journal   M. S. Yeh*, 曹龍泉, T. H. Chuang, Effects of Microstructures on Corrosion and Stress Corrosion Behavior of an Al-12.1at% Zn allo, J. Mater. Eng. Perf, 9, 396-401
• Journal   曹龍泉, M. S. Yeh, C. J. Lo, F. C. Wu, T. H. Chuang*, Evaluation of Low Temperature Superplastic Formability for Zn-22Al Thin Sheets, Z. Metallkunde, 91, 613-617

1998

• Journal   曹龍泉*, The degassing equipment for molten aluminum, J. Munic. Nan-Kang Technical High School, 16, 155-211