Sustainable Cooling of Application-Specific Integrated Circuit Chips
| Year | 2026 |
| Author | , , 賴炤容*, , |
| Author count | 5 |
| Created date | 2026-09-22 |
| Author order | 第三作者 |
| Corresponding author | 是 |
| Publication year | 2026 |
| Publication month | 8 |
| Journal name | Journal of Thermophysics and Heat Transfer |
| Journal sponsor | American Institute of Aeronautics and Astronautics |
| Publication area | 美國 |
| Volume | 40 |
| Issue | 3 |
| Start page | 583 |
| End page | 597 |
| Publication type | |
| Review system | 是 |
| Language | Foreign Language |
| Attached project | NSTC 113-2637-E-020-004 |