Magnetic Force Enhanced Atmospheric Plasma Polishing Ability to Improve Surface Roughness of Copper Base Materials

Magnetic Force Enhanced Atmospheric Plasma Polishing Ability to Improve Surface Roughness of Copper Base Materials

副教授    #7006   
年份2021
作者陳晧隆*
Author count1
Created date2021-09-15
作者順序1
通訊作者true
發表年份2021
會議名稱The 6th International Conference on Precision Machinery and Manufacturing Technology 2021 (ICPMMT 2021)
舉行之城市Pingtung
舉行之國家中華民國
開始日期2021-05-21
結束日期2021-05-23
審稿制度
發表語言中文
所屬計畫案MOST107-2622-E-020-012 -CC3