Thermo-mechanical Behavior of the Underfill/Solder Mask/Substrate Interface under Thermal Cycling
| Year | 2004 |
| Author | Chien C.H., 陳永昌*, Hsieh C.C., Chiou Y.T., Wu Y.D., Chen T.P. |
| Author count | 6 |
| Created date | 2019-02-19 |
| Author order | 第二作者 |
| Corresponding author | 是 |
| Publication year | 2004 |
| Publication month | 4 |
| Journal name | Experimental Mechanics |
| Publication area | 中華民國 |
| Start page | 214 |
| End page | 220 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |