Thermal and Flow Analysis of a Heated Electronic Component

Thermal and Flow Analysis of a Heated Electronic Component

Year2001
AuthorRJ Yang*, 傅龍明
Author count2
Created date2019-02-19
Author order第二作者
Corresponding author
Publication year2001
Publication month1
Journal nameInt. Journal of Heat and Mass Transfer
Journal sponsorElsevier
Publication area中華民國
Issue44
Start page2261
End page2275
Publication type
Review system
LanguageForeign Language
Attached project