The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu-0.5Al2O3 composite solder/Cu interface during soldering reaction

The morphology and kinetic evolution of intermetallic compounds at Sn–Ag–Cu solder/Cu and Sn–Ag–Cu-0.5Al2O3 composite solder/Cu interface during soldering reaction

Year2012
AuthorS. Y. Chang, 曹龍泉*, M. W. Wu, C. W. Chen
Author count4
Created date2019-02-19
Author order第二作者
Corresponding author
Publication year2012
Publication month1
Journal nameJ Mater Sci: Mater Electron
Journal sponsorSpringer
Publication area中華民國
Issue23
Start page100
End page107
Publication type
Review system
LanguageForeign Language
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