The Effect of Yttrium Addition on the Microstructures and Electrical Properties of Cu-Mn Alloy Thin Film
The Effect of Yttrium Addition on the Microstructures and Electrical Properties of Cu-Mn Alloy Thin Film
Year | 2019 |
Author | 李英杰* |
Author count | 1 |
Created date | 2020-03-18 |
Author order | 第三作者 |
Corresponding author | 是 |
Publication year | 2019 |
Publication month | 11 |
Journal name | Advances in Materials Science and Engineering |
Journal sponsor | Hindawi |
Publication area | 美國 |
Volume | 2019 |
Issue | ---- |
Start page | 1 |
End page | 7 |
Publication type | |
Review system | 是 |
Language | Foreign Language |
Attached project | 106-2221-E-020 -009 - |