The Effect of Moisture on the Interfacial Adhesion of IC Packages
| Year | 2002 |
| Author | |
| Created date | 2019-02-19 |
| Author order | 4 |
| Corresponding author | false |
| Publication year | 2002 |
| Symposium name | International Symposium on Experimental Mechanics |
| Publication country | 中華民國 |
| Start date | 2002-12-01 |
| End date | 2002-12-01 |
| Review system | 否 |
| Language | Traditional Chinese |