Study of interfacial reactions between Sn3.5Ag0.5Cu composite alloys and Cu substrate
| Year | 2011 |
| Author | 曹龍泉*, C.P. Chu,, S.F. Peng |
| Author count | 3 |
| Created date | 2019-02-19 |
| Author order | 第一作者 |
| Corresponding author | 是 |
| Publication year | 2011 |
| Publication month | 9 |
| Journal name | Microelectronic Engineering |
| Journal sponsor | Elsevier |
| Publication area | 中華民國 |
| Issue | 88 |
| Start page | 2964 |
| End page | 2969 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |