Study of interfacial reactions between Sn3.5Ag0.5Cu alloys and Cu substrate
| Year | 2009 |
| Author | 曹龍泉*, Chang, S.Y., , |
| Author count | 4 |
| Created date | 2019-02-19 |
| Author order | 第一作者 |
| Corresponding author | 是 |
| Publication year | 2009 |
| Publication month | 8 |
| Journal name | 2009 International Conference on Electronic Packaging Technology and High Density Packaging, |
| Publication area | 中華民國 |
| Start page | 886 |
| End page | 889 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |