Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0.5Cu lead-free solder
| Year | 2011 |
| Author | T. H. Chuang, M.W.Wu, S. Y. Chang, S. F. Ping, 曹龍泉* |
| Author count | 5 |
| Created date | 2019-02-19 |
| Author order | 第四(以上)作者 |
| Corresponding author | 是 |
| Publication year | 2011 |
| Publication month | 11 |
| Journal name | J Mater Sci: Mater Electron |
| Journal sponsor | springer |
| Publication area | 中華民國 |
| Issue | 22 |
| Start page | 1021 |
| End page | 1027 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |