Stability of PBGA Package’s Warpage Subjected to Hygro-thermal loading
| Year | 2006 |
| Author | Chien C.H., Chen T.P., 陳永昌, Chiou Y.T., Hsieh C.C., Wu Y.D. |
| Author count | 6 |
| Created date | 2019-02-19 |
| Author order | 第三作者 |
| Corresponding author | 否 |
| Publication year | 2006 |
| Publication month | 1 |
| Journal name | Microelectronics Reliability |
| Publication area | 中華民國 |
| Volume | Vol. 46 |
| Start page | 1139 |
| End page | 1147 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |