Spectrum Respones Analysis for PCB with Heating ICS in Different Heating Conditions

Spectrum Respones Analysis for PCB with Heating ICS in Different Heating Conditions

Professor    7017    wangbt@mail.npust.edu.tw
Year2011
Author王栢村*, Lee, Y. C., Yi-Shao Lai, Chang-Lin Yeh, Ying-Chih Lee
Author count5
Created date2019-02-19
Author order1
Corresponding authorfalse
Publication year2011
Symposium name The 6th International Microsystems, Packaging Assembly and Circuits Technology Conference (IMPACT 2011)
Publication city台北
Publication country中華民國
Start date2011-10-19
End date2011-10-19
Review system
LanguageTraditional Chinese