Soldering of Transparent Conductive Ceramic Sputtering Targets to Backing Plates Using a Low Melting Point Bi-Sn-In-Ti Filler Metal

Soldering of Transparent Conductive Ceramic Sputtering Targets to Backing Plates Using a Low Melting Point Bi-Sn-In-Ti Filler Metal

Year2009
Author曹龍泉, Shih-Ying Chang*, Zhen-Sheng Yang, Jiunn-Ren Jaw, Yen-Huan Lei
Author count5
Created date2019-02-19
Author order1
Corresponding authorfalse
Publication year2009
Symposium name台灣真空學會年會2009年論文研討會
Publication country中華民國
Start date2009-12-18
End date2009-12-18
Review system
LanguageTraditional Chinese