Soldering of Transparent Conductive Ceramic
Sputtering Targets to Backing Plates Using a Low
Melting Point Bi-Sn-In-Ti Filler Metal
Soldering of Transparent Conductive Ceramic Sputtering Targets to Backing Plates Using a Low Melting Point Bi-Sn-In-Ti Filler Metal
| Year | 2009 |
| Author | 曹龍泉, Shih-Ying Chang*, Zhen-Sheng Yang, Jiunn-Ren Jaw, Yen-Huan Lei |
| Author count | 5 |
| Created date | 2019-02-19 |
| Author order | 1 |
| Corresponding author | false |
| Publication year | 2009 |
| Symposium name | 台灣真空學會年會2009年論文研討會 |
| Publication country | 中華民國 |
| Start date | 2009-12-18 |
| End date | 2009-12-18 |
| Review system | 否 |
| Language | Traditional Chinese |