Simulation Analysis and Experimental Verification of Electroplating Process for Flip-Chip Solder Bumps
| Year | 2002 |
| Author | 苗志銘* |
| Author count | 1 |
| Created date | 2019-02-19 |
| Author order | 第一作者 |
| Corresponding author | 是 |
| Publication year | 2002 |
| Publication month | 1 |
| Journal name | Journal of Materials Science and Engineering |
| Publication area | 中華民國 |
| Volume | Vol. 34 |
| Issue | No. 1 |
| Start page | 8 |
| End page | 16 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |