Shear Strength and Failure Behavior of SnAgSb Solder Joints with Au/Ni-P/Cu UBM
| Year | 2008 |
| Author | H.T. Lee*, S.Y. Hu, 洪廷甫, Y.F. Chen |
| Author count | 4 |
| Created date | 2019-02-19 |
| Author order | 第三作者 |
| Corresponding author | 否 |
| Publication year | 2008 |
| Publication month | 6 |
| Journal name | Journal of Electronic Materials |
| Journal sponsor | TMS |
| Publication area | 中華民國 |
| Volume | 37 |
| Issue | 6 |
| Start page | 867 |
| End page | 873 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |