Response Prediction and Verification for PCB with Package due to Thermal and Random Vibration Coupling Effects
| Year | 2009 |
| Author | 王栢村*, 洪辰雄, Fu-Xiang Hsu, Xiu-Wei Liang |
| Author count | 4 |
| Created date | 2019-02-19 |
| Author order | 1 |
| Corresponding author | false |
| Publication year | 2009 |
| Symposium name | The 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009) |
| Publication city | 台北 |
| Publication country | 中華民國 |
| Start date | 2009-10-22 |
| End date | 2009-10-22 |
| Review system | 否 |
| Language | Traditional Chinese |