Reliability Testing and Verification in Pb Free Filp Chip Assembly Technology

Reliability Testing and Verification in Pb Free Filp Chip Assembly Technology

Professor    6007、7554    whl@mail.npust.edu.tw
Year2004
Author盧威華*, ,
Author count3
Created date2019-02-19
Author order第一作者
Corresponding author
Publication year2004
Publication month8
Journal name電子與材料季刊
Publication area中華民國
Publication type
Review system
LanguageTraditional Chinese
Attached project