Model Verification of Assembly Populated Printed Circuit Boards Under Environmental Vibration Testing
Model Verification of Assembly Populated Printed Circuit Boards Under Environmental Vibration Testing
Year | 2006 |
Author | 王栢村*, , , , |
Author count | 5 |
Created date | 2019-02-19 |
Author order | 1 |
Corresponding author | false |
Publication year | 2006 |
Symposium name | Proceedings of International Microelectronic and Packaging Society (IMAPS 2006) |
Publication city | 台北 |
Publication country | 中華民國 |
Start date | 2006-01-01 |
End date | 2006-01-01 |
Review system | 否 |
Language | Foreign Language |