Model Verification of Assembly Populated Printed Circuit Boards Under Environmental Vibration Testing

Model Verification of Assembly Populated Printed Circuit Boards Under Environmental Vibration Testing

Professor    7017    wangbt@mail.npust.edu.tw
Year2006
Author王栢村*, , , ,
Author count5
Created date2019-02-19
Author order1
Corresponding authorfalse
Publication year2006
Symposium nameProceedings of International Microelectronic and Packaging Society (IMAPS 2006)
Publication city台北
Publication country中華民國
Start date2006-01-01
End date2006-01-01
Review system
LanguageForeign Language