Magnetic Force Enhanced Atmospheric Plasma Polishing Ability to Improve Surface Roughness of Copper Base Materials
Magnetic Force Enhanced Atmospheric Plasma Polishing Ability to Improve Surface Roughness of Copper Base Materials
Year | 2021 |
Author | 陳晧隆* |
Author count | 1 |
Created date | 2021-09-15 |
Author order | 1 |
Corresponding author | true |
Publication year | 2021 |
Symposium name | The 6th International Conference on Precision Machinery and Manufacturing Technology 2021 (ICPMMT 2021) |
Publication city | Pingtung |
Publication country | 中華民國 |
Start date | 2021-05-21 |
End date | 2021-05-23 |
Review system | 是 |
Language | Traditional Chinese |
Attached project | MOST107-2622-E-020-012 -CC3 |