Magnetic Force Enhanced Atmospheric Plasma Polishing Ability to Improve Surface Roughness of Copper Base Materials

Magnetic Force Enhanced Atmospheric Plasma Polishing Ability to Improve Surface Roughness of Copper Base Materials

Associate Professor    #7006   
Year2021
Author陳晧隆*
Author count1
Created date2021-09-15
Author order1
Corresponding authortrue
Publication year2021
Symposium nameThe 6th International Conference on Precision Machinery and Manufacturing Technology 2021 (ICPMMT 2021)
Publication cityPingtung
Publication country中華民國
Start date2021-05-21
End date2021-05-23
Review system
LanguageTraditional Chinese
Attached projectMOST107-2622-E-020-012 -CC3