Investigation of the Adhesion Strength of Underfill/Solder Mask/Substrate Joints Under Thermal Cycling
| Year | 2003 |
| Author | *, 陳永昌, , , |
| Author count | 5 |
| Created date | 2019-02-19 |
| Author order | 2 |
| Corresponding author | false |
| Publication year | 2003 |
| Symposium name | SEM Annual Conference & Exposition on Experimental and Applied Mechanics |
| Start page | 1 |
| End page | 8 |
| Publication city | Charlotte, North Carolina |
| Publication country | 中華民國 |
| Start date | 2003-06-02 |
| End date | 2003-06-02 |
| Review system | 否 |
| Language | Foreign Language |