Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads
| Year | 2008 |
| Author | C.C. Chi, 曹龍泉, C.W. Tsao, T.H. Chuang* |
| Author count | 4 |
| Created date | 2019-02-19 |
| Author order | 第二作者 |
| Corresponding author | 否 |
| Publication year | 2008 |
| Publication month | 1 |
| Journal name | Intermetallic reactions in reflowed and aged Sn-58Bi BGA packages with Au/Ni/Cu pads |
| Publication area | 中華民國 |
| Volume | 17 |
| Issue | 1 |
| Start page | 134 |
| End page | 140 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |