Intermetallic Compounds Formed During the Reflow of In-49Sn Solder Ball Array Packages
| Year | 2003 |
| Author | T. H. Chuang,*, 曹龍泉, H. M. Wu |
| Author count | 3 |
| Created date | 2019-02-19 |
| Author order | 第二作者 |
| Corresponding author | 否 |
| Publication year | 2003 |
| Publication month | 3 |
| Journal name | Journal of Electronic Materials |
| Publication area | 中華民國 |
| Volume | 3 |
| Issue | 3 |
| Start page | 195 |
| End page | 200 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |