Interfacial reactions between liquid Sn3.5Ag0.5Cu solders and Ag substrates
| Year | 2011 |
| Author | R. W. Wu, 曹龍泉*, S. Y. Chang, C. C. Jain, R. S. Chen |
| Author count | 5 |
| Created date | 2019-02-19 |
| Author order | 第二作者 |
| Corresponding author | 是 |
| Publication year | 2011 |
| Publication month | 8 |
| Journal name | Journal of Materials Science: Materials in Electronics |
| Journal sponsor | Springer |
| Publication area | 中華民國 |
| Issue | 22 |
| Start page | 1181 |
| End page | 1187 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |