Influences of argon plasma cleaning on the die-shear force of chip and copper/polyimide flexible substrate assembly using a non-conductive film
| Year | 2017 |
| Author | |
| Created date | 2019-01-16 |
| Author order | 第一作者 |
| Corresponding author | 否 |
| Publication year | 2017 |
| Publication month | 10 |
| Journal name | Journal of the Chinese Institute of Engineers |
| Publication area | 中華民國 |
| Volume | ---- |
| Issue | 33 |
| Publication type | |
| Review system | 是 |
| Language | Foreign Language |
| Attached project | ---- |