Influence of die-shift-distance of overhang dies on residual thermal shear stress in 5-chip SiP after EMC curing
| Year | 2016 |
| Author | |
| Created date | 2019-01-16 |
| Author order | 第一作者 |
| Corresponding author | 否 |
| Publication year | 2016 |
| Publication month | 2 |
| Journal name | Materials and Design |
| Publication area | 英國 |
| Volume | 92 |
| Issue | ---- |
| Publication type | |
| Review system | 是 |
| Language | Foreign Language |
| Attached project | ---- |