Influence of TiO2 nanoparticles addition on the microstructural and mechanical properties of Sn0.7Cu nano-composite solder
| Year | 2012 |
| Author | 曹龍泉*, C.H. Huang, R.S. Chen |
| Author count | 3 |
| Created date | 2019-02-19 |
| Author order | 第一作者 |
| Corresponding author | 是 |
| Publication year | 2012 |
| Publication month | 5 |
| Journal name | Materials Science and Engineering A |
| Journal sponsor | Elsevier |
| Publication area | 中華民國 |
| Issue | 545 |
| Start page | 194 |
| End page | 200 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |