Influence of Nano-TiCh Reinforcements on the Wettability and Interfacial Reactions of Novel Lead-Free Sn3.5AgO.5Zn Composite Solder/Cu Solder Joints
| Year | 2011 |
| Author | L. P. Feng, S. Y. Chang, 曹龍泉*, F. S. Wang |
| Author count | 4 |
| Created date | 2019-02-19 |
| Author order | 第三作者 |
| Corresponding author | 是 |
| Publication year | 2011 |
| Publication month | 8 |
| Journal name | 2011 International Conference on Electronic Packaging Technology & High Density Packaging |
| Publication area | 中華民國 |
| Start page | 260 |
| End page | 263 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |