Influence of Lanthanum Addition on Microstructure and Properties of Sn-3.5Ag Solder System
| Year | 2009 |
| Author | H.T. Lee*, Y.F. Chen, 洪廷甫, Y.J. Huang |
| Author count | 4 |
| Created date | 2019-02-19 |
| Author order | 第三作者 |
| Corresponding author | 否 |
| Publication year | 2009 |
| Publication month | 1 |
| Journal name | IEEE Xplore, Electronic Materials and Packaging, 2008 |
| Publication area | 中華民國 |
| Start page | 183 |
| End page | 186 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |