Influence of Al2O3 Nanoparticles on the Morphology and Growth Kinetics of Cu-Sn Intermetallic Compounds in Sn-Ag-Zn/Cu Solder Joints

Influence of Al2O3 Nanoparticles on the Morphology and Growth Kinetics of Cu-Sn Intermetallic Compounds in Sn-Ag-Zn/Cu Solder Joints

Year2024
Author曹龍泉*, Lai, Pei-Chun
Author count2
Created date2025-02-28
Author order第一作者
Corresponding author
Publication year2024
Publication month10
Journal nameCrystals
Publication area瑞士聯邦
Volume12
Issue8
Start page1
End page12
Publication type
Review system
LanguageForeign Language
Attached projectNSTC 113-2221-E-020-014