Improve Chip Side Wall Crack Issue in Nanometer Packing Process of Semiconductor.
| Year | 2020 |
| Author | , , , 鍾智超, , * |
| Author count | 6 |
| Created date | 2021-09-05 |
| Author order | 第四(以上)作者 |
| Corresponding author | 否 |
| Publication year | 2020 |
| Publication month | 12 |
| Journal name | IEEE Transactions on Components, Packaging and Manufacturing Technology |
| Publication area | 阿富汗伊斯蘭國 |
| Volume | 11 |
| Issue | 2 |
| Start page | 173 |
| End page | 180 |
| Publication type | |
| Review system | 是 |
| Language | Foreign Language |