Finite Element Model Verification for Packaged Printed Circuit Board by Experimental Modal Analysis
| Year | 2008 |
| Author | *, 王栢村, , , |
| Author count | 5 |
| Created date | 2019-02-19 |
| Author order | 第二作者 |
| Corresponding author | 否 |
| Publication year | 2008 |
| Publication month | 1 |
| Journal name | Microelectronics Reliability |
| Publication area | 中華民國 |
| Volume | 48 |
| Start page | 1837 |
| End page | 1846 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |