Evolution of Ag3Sn compounds and microhardness of Sn3.5Ag0.5Cu nano-composite solders during different cooling rate and aging
| Year | 2012 |
| Author | T.H. Chuang, 曹龍泉*, Chien-Han Chung, S.Y. Chang |
| Author count | 4 |
| Created date | 2019-02-19 |
| Author order | 第二作者 |
| Corresponding author | 是 |
| Publication year | 2012 |
| Publication month | 8 |
| Journal name | Materials & Desig |
| Publication area | 中華民國 |
| Issue | 39 |
| Start page | 475 |
| End page | 483 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |