Evolution of Ag3Sn Compounds in Solidification of Eutectic Sn-3.5Ag Solder

Evolution of Ag3Sn Compounds in Solidification of Eutectic Sn-3.5Ag Solder

Year2009
AuthorH.T. Lee*, Y.F. Chen, 洪廷甫, K.T. Shih
Author count4
Created date2019-02-19
Author order第三作者
Corresponding author
Publication year2009
Publication month8
Journal nameIEEE Xplore
Publication area中華民國
Start page646
End page649
Publication type
Review system
LanguageForeign Language
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