Effects of nanoparticles on the thermal, microstructural and mechanical properties of novel Sn3.5Ag0.5Zn composite solders
| Year | 2018 |
| Author | C. L. Chuang, 曹龍泉* |
| Author count | 2 |
| Created date | 2019-03-18 |
| Author order | 第二作者 |
| Corresponding author | 是 |
| Publication year | 2018 |
| Publication month | 3 |
| Journal name | Journal of Materials Science: Materials in Electronics |
| Journal sponsor | SPRINGER |
| Publication area | 荷蘭王國 |
| Issue | 29 |
| Start page | 4096 |
| End page | 4105 |
| Publication type | |
| Review system | 是 |
| Language | Bilingual |
| Attached project | MOST 106-2221-E-020-015 |