Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder

Effects of nano-Al2O3 additions on microstructure development and hardness of Sn3.5Ag0.5Cu solder

Year2010
Author曹龍泉*, S.Y. Chang, C.I. Lee, W.H. Sun, C.H. Huang
Author count5
Created date2019-02-19
Author order第一作者
Corresponding author
Publication year2010
Publication month3
Journal nameMaterials and Design
Journal sponsorElsevier
Publication area中華民國
Issue31
Start page4831
End page4835
Publication type
Review system
LanguageForeign Language
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