Effects of Nano-TiO2 additions on thermal analysis, microstructure and tensile properties of Sn3.5Ag0.25Cu solder
| Year | 2010 |
| Author | 曹龍泉*, S.Y. Chang |
| Author count | 2 |
| Created date | 2019-02-19 |
| Author order | 第一作者 |
| Corresponding author | 是 |
| Publication year | 2010 |
| Publication month | 1 |
| Journal name | Materials and Design |
| Publication area | 中華民國 |
| Issue | 31 |
| Start page | 990 |
| End page | 993 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |