Effect of nano-TiO2 addition on the microstructure and bonding strengths of Sn3.5Ag0.5Cu composite solder BGA packages with immersion Sn surface finish
| Year | 2011 |
| Author | 梁茲程, 曹龍泉*, C. J. Fang, C. P. Chu |
| Author count | 4 |
| Created date | 2019-02-19 |
| Author order | 第二作者 |
| Corresponding author | 是 |
| Publication year | 2011 |
| Publication month | 9 |
| Journal name | J Mater Sci: Mater Electron |
| Journal sponsor | Springer |
| Publication area | 中華民國 |
| Issue | 22 |
| Start page | 1443 |
| End page | 1449 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |