Effect of addition of TiO2 nanoparticles on the microstructure, microhardness and interfacial reactions of Sn3.5AgXCu solder
| Year | 2011 |
| Author | S.Y. Chang, C.C. Jain, T.H. Chuang, L.P. Feng, 曹龍泉* |
| Author count | 5 |
| Created date | 2019-02-19 |
| Author order | 第四(以上)作者 |
| Corresponding author | 是 |
| Publication year | 2011 |
| Publication month | 12 |
| Journal name | Materials and Design |
| Journal sponsor | Elsevier |
| Publication area | 中華民國 |
| Issue | 32 |
| Start page | 4720 |
| End page | 4727 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |