Effect of TiO2 nanoparticles on the microstructure and bonding strengths of Sn0.7Cu composite solder BGA packages with immersion Sn surface finish
| Year | 2012 |
| Author | 曹龍泉*, M. W. Wu, S. Y. Chang |
| Author count | 3 |
| Created date | 2019-02-19 |
| Author order | 第一作者 |
| Corresponding author | 是 |
| Publication year | 2012 |
| Publication month | 3 |
| Journal name | J Mater Sci: Mater Electron |
| Journal sponsor | Springer |
| Publication area | 中華民國 |
| Issue | 23 |
| Start page | 681 |
| End page | 687 |
| Publication type | |
| Review system | 否 |
| Language | Foreign Language |
| Attached project | 無 |