Effect of TiO2 nanoparticle addition and cooling rate on microstructure and mechanical properties of novel Sn1.5Sb0.7Cu solders
| Year | 2015 |
| Author | |
| Created date | 2019-01-16 |
| Author order | 第一作者 |
| Corresponding author | 是 |
| Publication year | 2015 |
| Publication month | 2 |
| Journal name | Journal of Materials Science - Materials in Electronics |
| Publication area | 英國 |
| Volume | ---- |
| Issue | 26 |
| Publication type | |
| Review system | 是 |
| Language | Foreign Language |
| Attached project | MOST 103-2221-E-020-014. |