Effect of TiO2 addition in Sn-Cu Solder Balls on the Microstructure and Shearing Strength of BGA Packages
| Year | 2011 |
| Author | 曹龍泉*, C. H. Chen, F. S. Wang |
| Author count | 3 |
| Created date | 2019-02-19 |
| Author order | 1 |
| Corresponding author | false |
| Publication year | 2011 |
| Symposium name | 2011 兩岸綠色暨防災科技學術研討會 |
| Start page | 1 |
| End page | 4 |
| Publication city | 屏東 |
| Publication country | 中華民國 |
| Start date | 2011-10-12 |
| End date | 2011-10-12 |
| Review system | 否 |
| Language | Traditional Chinese |